U201: Micron MT53E768M32D4DT-053 WT:E mobile LPDDR4 SDRAM 3GB (32 x 768Mb) 2.133GHz, VFBGA-200, 10x14.5mm Note: This is Micron's automotive-series RAM. This RAM can support up to LPDDR4-4266, but the i.MX 8M Quad only supports up to LPDDR4-3200.
P.5 CPU IO
U3: Unidentified 12-pin chip which is labeled as "NC" (not connected) (pins: A1, A2, A3, A4, B1, B2, B3, B4, /0E & GND) Note:According to LuluColtrane: "The component is not placed. It was an optional voltage translator for the I2C bus. The voltage translation role is implemented by the two MOSFETs Q4 and Q5 instead."
U601: Kioxia (formerly Toshiba) THGBMHG8C2LBAIR 32 GB NAND Flash BGA 153 [datasheet for 64GB model] Note 1: Schematics say eMMC 5.0, but product description says MMC 5.1. Note 2: Probably TLC Flash, but there is no public info available on the type of Flash. Kioxia makes both FG NAND and BiCS NAND Flash memory.
Note: There is a floating comment with the following parts (which I assume Purism considered, but didn’t end up using):
U1: ROHM BD71837MWV programmable power management integrated circuit (PMIC), 1.71-5.5 V input, max 4A output, 0.7 - 3.3 V output, UQFN-68 package Note: This is probably the BD71837MWV-E2, which is no longer in stock, so this part may change.
U704: Union Semiconductor UM805RE 4-Pin uP Voltage Monitors with Manual Reset Input
D3, D21: ROHM RB751G-40 Schottky barrier diode 30V 30mA surface mount SOD-723 package (for GPIO/WDOG PWR OFF->ON and Reset Button)
L702, L703, L704, L705, L707, L706, L710: Sunlord WPN252012ER47MT power inductor 470nH ±20% 4.1A 26mΩ SMD, 2.5x2x1.2 mm (for DRAM, VPU, GPU and VDD_1V8)
L32: Sunlord WPN252012H1R0MT wire wound power inductor 1uH ±20% SMD, 2.5×2.0x1.2 mm
U50, U51: Unidentified 6-pin chip which is labeled as “NC” (not connected) (pins: VOUT, GND, ON, VIN, GND, VIN) Note:According to LuluColtrane: "Components not placed. Most likely a placeholder for trying high-side MOSFET switches like the 2 AP2281 above if the AP2281 would have not been satisfying, for components with a different PCB footprint/pinout than the AP2281."
J22: OCN / Yaqi / Archie OK-06F034-04 34-pin 0.4mm pitch female inline connector (for rear camera connector) Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
Silicon Labs (formerly Redpine Signals) RS9116 802.11 a/b/g/n 2.4 & 5 GHz via SDIO 2.0 on a M.2 2230B key card; LGA (unclear which module size is being used). Note: The schematics (p.15) say "Bluetooth 4.1", but the RS9116 supports Bluetooth 5.0. However, only Bluetooth 4 has been tested so far.
Mantix MLAF057WE51 X 5.7″ IPS a-Si LCD, 720×1440 pixels, 16.7M colors, 282 PPI, 1500:1 contrast ratio, 90% sRGB, MIPI DSI. Note: No mention of hardened glass, but the Librem 5 comes with a plastic screen protector.
Samsung S5K3L6XX image sensor for back camera, 13.25 MP , CMOS, 1/3", 4224×3136 pixels, 4K@30fps, FHD@60fps, HD@120fps, f/1.9, 28mm, auto-focus: 10cm - ∞, 81.5° FOV, LED flash (not yet supported in kernel)
Note: The Samsung S5K3L6XX is used in the Galaxy J4+, which takes decent photos according this review, but it has the Snapdragon 425 (4x 1.4GHz Cortex-A53, 28nm) which is comparable in CPU power to the i.MX 8M Quad and the J4+’s highest resolution video is 1080p at 30fps. The Samsung 13MP image sensor in the Librem 5 is capable of capturing 4K video at 30fps, but the i.MX 8M Quad has no hardware video encoder and its documentation indicates that it is only capable of encoding 1080p video at 30fps in software. There is currently no kernel support for the front and back cameras and there is only a mockup of a future camara app for the Librem 5.
SK hynix YACG4D0C9SHC image sensor for front camera, 8.0 MP, CMOS, 1/4", 3264×2448 pixels, QUXGA@30fps, FHD@60fps (crop), HD@90fps, focusing range: 28.9-65.0cm, 83.3° FOV (not yet supported in kernel)
J8: BTB6-1.27 6-pin board-to-board connector with 1.27mm pitch
J11: Unidentified 46-pin connector
ANT1: 4-pin 4G antenna end, 1.5x0.6 mm
Here is the component count in the Librem 5's two printed circuit boards:
Type of component
Antenna connectors (ANTxxx)
Wire links (Jxxx)
Wire links with voltage (JVxxx)
Test controls (TCxxx)
Test points (TPxxx)
Test screw (TSxxx)
Test voltage (TVxxx)
Transient voltage suppressors (TVSxxx)
Integrated circuits (Uxxxx)
Crystal oscillators (Yxxxx)
If the test elements aren't included (since they are printed in the board), then the two Librem 5 boards together have 1174 components. This doesn't include the components in the two M.2 cards, which would increase the component count for the Librem 5.