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Update Librem 5 component list authored by Amos Batto's avatar Amos Batto
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Hardware/Librem-5-component-list.md
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......@@ -400,7 +400,7 @@ Here is the component count in the Librem 5's two printed circuit boards:
If the test elements aren't included (since they are printed in the board), then the two Librem 5 boards together have 1174 components. In addition, the RS9116 WiFi/Bluetooth M.2 card contains 87 components and the BM818 modem M.2 card contains 6 components, so the 4 boards in the Librem 5 contain a total of 1267 components.
In comparison, the typical smartphone has between 400 and 600 components, which shows how much easier it is to design a phone with an integrated mobile SoC. The Librem 5 has 2.5 times more components than the typical smartphones because it uses 6 separate chips ([i.MX 8M Quad](https://www.nxp.com/docs/en/data-sheet/IMX8MDQLQCEC.pdf), [RS9116](https://www.silabs.com/wireless/wi-fi/rs9116-wi-fi-transceiver-modules), [BM818](http://www.broadmobi.com/en/module_show.php?id=18)/[PLS8](https://storage.pardot.com/128881/202595/Thales_Cinterion_PLS8_Datasheet.pdf), [Teseo-LIV3F](https://www.st.com/resource/en/datasheet/teseo-liv3f.pdf), [WM8962](https://www.cirrus.com/products/wm8962-62b/) and [bq25895](https://www.ti.com/lit/ds/symlink/bq25895.pdf)) in place of an integrated mobile SoC, plus it has extra circuitry for its hardware kill switches and the smartcard reader (which requires a separate ARM microcontroller).
In comparison, the typical smartphone has between 400 and 600 components, which shows how much easier it is to design a phone with an integrated mobile SoC. The Librem 5 has 2.5 times as many components as the typical smartphone, because it uses 6 separate chips ([i.MX 8M Quad](https://www.nxp.com/docs/en/data-sheet/IMX8MDQLQCEC.pdf), [RS9116](https://www.silabs.com/wireless/wi-fi/rs9116-wi-fi-transceiver-modules), [BM818](http://www.broadmobi.com/en/module_show.php?id=18)/[PLS8](https://storage.pardot.com/128881/202595/Thales_Cinterion_PLS8_Datasheet.pdf), [Teseo-LIV3F](https://www.st.com/resource/en/datasheet/teseo-liv3f.pdf), [WM8962](https://www.cirrus.com/products/wm8962-62b/) and [bq25895](https://www.ti.com/lit/ds/symlink/bq25895.pdf)) in place of an integrated mobile SoC, plus it has extra circuitry for its hardware kill switches and the smartcard reader (which requires a separate ARM microcontroller).
It's interesting to compare the Librem 5 with the [PinePhone](https://www.pine64.org/pinephone/), which has 4 chips in place of an integrated mobile SoC. The PinePhone contains 672 [components in its two PCBs](https://wiki.pine64.org/index.php?title=PinePhone_component_list) (not including the test elements).
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