-
Eric Kuzmenko authored
Route the VBAT_REG output to the In3.Cu layers, begin placing the passive components around the TCPC PHY chip (same placement positions as EmCraft's), add SIM card slot 3D model and move it onto the PCB area
cffaded9
Due to an influx of spam, we have had to impose restrictions on new accounts. Please see this wiki page for instructions on how to get full permissions. Sorry for the inconvenience.
Route the VBAT_REG output to the In3.Cu layers, begin placing the passive components around the TCPC PHY chip (same placement positions as EmCraft's), add SIM card slot 3D model and move it onto the PCB area