Commit 16236bd5 authored by Eric Kuzmenko's avatar Eric Kuzmenko
Browse files

Place and route the battery thermistor circuit, add covered B.Cu pads to the...

Place and route the battery thermistor circuit, add covered B.Cu pads to the footprints which have thermal exposed pads
parent 2a2eba5c
......@@ -2333,9 +2333,7 @@ F 9 "https://www.digikey.com/products/en/resistors/chip-resistor-surface-mount/5
1 3900 4250
-1 0 0 -1
$EndComp
Text Notes 6250 5250 0 60 ~ 0
Battery holder gives ~~1mm clearance underneath the battery\nThermistor is 1.1±0.15mm thick, should fit fine with stack-up
Text Notes 6250 5500 0 60 ~ 0
Text Notes 6300 5400 0 60 ~ 0
Battery holder seems to fit up to ~~68.88mm long batteries\nneed to test 18650 protected cells which are ~~69.35mm long
$Comp
L C C305
......
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(module AP22814 (layer F.Cu) (tedit 5B29F1B2)
(module AP22814 (layer F.Cu) (tedit 5B46543D)
(fp_text reference REF** (at 0 -2) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
......@@ -26,7 +26,9 @@
(pad 3 smd rect (at 0.65 0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at 0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 2 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 2 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 2 smd rect (at 0 0) (size 1.67 0.9) (layers B.Cu))
(pad 2 smd rect (at 0 0.3) (size 0.37 1.5) (layers B.Cu))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-6-1EP_2x2mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module AR8031 (layer F.Cu) (tedit 5B329E60)
(module AR8031 (layer F.Cu) (tedit 5B465510)
(solder_mask_margin 0.055)
(attr smd)
(fp_text reference REF** (at 0 -4.5) (layer F.SilkS)
......@@ -78,22 +78,24 @@
(pad 49 smd rect (at 1 -1) (size 1.5 1.5) (layers F.Cu F.Paste))
(pad 49 smd rect (at 1 1) (size 1.5 1.5) (layers F.Cu F.Paste))
(pad 49 smd rect (at -1 1) (size 1.5 1.5) (layers F.Cu F.Paste))
(pad 49 thru_hole circle (at -0.5 -0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 -0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 -1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 -1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 -1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 -1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 -0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 1.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 -0.5) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 -0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 -0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 -1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 -1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 -1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 -1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 -0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 1.5 1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 1.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -1.5 0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at -0.5 0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 thru_hole circle (at 0.5 -0.5) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 49 smd rect (at 0 0) (size 3.9 3.9) (layers B.Cu)
(solder_paste_margin_ratio -0.5))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/UQFN-48-1EP_6x6mm_Pitch0.4mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
......@@ -36,7 +36,7 @@
(pad "" np_thru_hole circle (at -27 0) (size 3 3) (drill 3) (layers *.Cu *.Mask)
(solder_mask_margin 0.000001) (clearance 0.225))
(model ${KIPRJMOD}/packages3d/BHC-18650-1P.wrl
(at (xyz 1.697 0.61 0))
(at (xyz 1.694 0.6107 0))
(scale (xyz 0.394 0.394 0.394))
(rotate (xyz 0 0 270))
)
......
(module BQ25896 (layer F.Cu) (tedit 5B457AFF)
(module BQ25896 (layer F.Cu) (tedit 5B464B1C)
(solder_mask_margin 0.07)
(solder_paste_margin -0.025)
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
......@@ -87,6 +87,8 @@
(pad 25 thru_hole circle (at 0.9 -0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 -0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 smd rect (at 0 0) (size 2.7 2.7) (layers B.Cu)
(solder_paste_margin_ratio -0.5))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module MIC2876 (layer F.Cu) (tedit 5B2711E3)
(module MIC2876 (layer F.Cu) (tedit 5B4653EA)
(descr http://ww1.microchip.com/downloads/en/DeviceDoc/20005572A.pdf)
(tags "DFN 0.5")
(solder_mask_margin 0.05)
......@@ -32,7 +32,9 @@
(pad 9 smd rect (at 0 0) (size 0.6 1.2) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.5))
(pad 9 smd rect (at 0 0) (size 0.4 0.9) (layers F.Paste))
(pad 9 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 smd rect (at 0 0) (size 0.6 1.2) (layers B.Cu)
(solder_paste_margin_ratio -0.5))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-8-1EP_2x2mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module PAM2841GR (layer F.Cu) (tedit 5B272160)
(module PAM2841GR (layer F.Cu) (tedit 5B465468)
(descr https://www.diodes.com/assets/Datasheets/PAM2841.pdf)
(tags "DFN 0.5")
(solder_mask_margin 0.05)
......@@ -31,8 +31,10 @@
(pad 8 smd rect (at 0.905 -0.75) (size 0.49 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 0.9 1.6) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.1))
(pad 9 thru_hole circle (at 0 -0.4) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0 0.4) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0 -0.4) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0 0.4) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 smd rect (at 0 0) (size 0.9 1.6) (layers B.Cu)
(solder_paste_margin_ratio -0.1))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-8-1EP_2x2mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module PTN36043 (layer F.Cu) (tedit 5B457B36)
(module PTN36043 (layer F.Cu) (tedit 5B464CFF)
(tags "USB Type-C SuperSpeed active switch")
(solder_mask_margin 0.05)
(clearance 0.1)
......@@ -45,4 +45,6 @@
(pad 19 thru_hole circle (at 0 -0.45) (size 0.2 0.2) (drill 0.2) (layers *.Cu F.Mask))
(pad 19 thru_hole circle (at 0 0.45) (size 0.2 0.2) (drill 0.2) (layers *.Cu F.Mask))
(pad 19 smd rect (at 0 0) (size 0.95 1.3) (layers F.Paste))
(pad 19 smd rect (at 0 0) (size 1 1.4) (layers B.Cu)
(solder_paste_margin_ratio -0.5))
)
(module PTN5110 (layer F.Cu) (tedit 5B457B64)
(module PTN5110 (layer F.Cu) (tedit 5B464CCF)
(descr https://www.nxp.com/docs/en/data-sheet/PTN5110_SDS.pdf)
(tags "USB PD TCPC PHY IC")
(solder_mask_margin 0.05)
......@@ -62,4 +62,6 @@
(solder_paste_margin -0.000001) (solder_paste_margin_ratio -0.08))
(pad 17 thru_hole circle (at -0.3 -0.2) (size 0.254 0.254) (drill 0.254) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0.3 0.2) (size 0.254 0.254) (drill 0.254) (layers *.Cu F.Mask))
(pad 17 smd rect (at 0 0) (size 1.1 1) (layers B.Cu)
(solder_paste_margin -0.000001) (solder_paste_margin_ratio -0.08))
)
(module RT8070 (layer F.Cu) (tedit 5B29EAAC)
(module RT8070 (layer F.Cu) (tedit 5B4653BF)
(descr https://www.richtek.com/assets/podfiles/PT-000014_FOOTPRINT.pdf)
(tags RT8070)
(solder_mask_margin 0.05)
......@@ -53,11 +53,13 @@
(solder_paste_margin_ratio -0.14))
(pad 9 smd rect (at -0.575 -0.575) (size 1.15 1.15) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.14))
(pad 9 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 -0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 -0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 -0.8) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 -0.8) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 0.8) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 0.8) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 smd rect (at 0 0) (size 2.3 2.3) (layers B.Cu)
(solder_paste_margin_ratio -0.14))
(model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module SEC1110 (layer F.Cu) (tedit 5B289B4F)
(module SEC1110 (layer F.Cu) (tedit 5B465554)
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(fp_text reference REF** (at 0 -4) (layer F.SilkS)
......@@ -38,15 +38,17 @@
(pad 11 smd oval (at 2.63 -0.4) (size 1.25 0.37) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 3.1 3.1) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.125))
(pad 17 thru_hole circle (at 0 -1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 -1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0 1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 -1.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0 -1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 -1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 1.2 1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0 1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at -1.2 -1.2) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 17 smd rect (at 0 0) (size 3.1 3.1) (layers B.Cu)
(solder_paste_margin -0.125))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-16-1EP_5x5mm_Pitch0.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module SGTL5000XNLA3R2 (layer F.Cu) (tedit 5B2886B1)
(module SGTL5000XNLA3R2 (layer F.Cu) (tedit 5B465496)
(descr https://www.nxp.com/docs/en/application-note/AN1902.pdf)
(tags " SGTL5000XNLA3R2")
(solder_mask_margin 0.09)
......@@ -49,11 +49,13 @@
(pad 18 smd rect (at 0 -1.405) (size 0.22 0.71) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -0.4 -1.405) (size 0.22 0.71) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -0.8 -1.405) (size 0.22 0.71) (layers F.Cu F.Paste F.Mask))
(pad 21 thru_hole circle (at -0.5 -0.5) (size 0.4 0.4) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at -0.5 0.5) (size 0.4 0.4) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0.5 0.5) (size 0.4 0.4) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0.5 -0.5) (size 0.4 0.4) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at -0.5 -0.5) (size 0.23 0.23) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at -0.5 0.5) (size 0.23 0.23) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0.5 0.5) (size 0.23 0.23) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0.5 -0.5) (size 0.23 0.23) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 thru_hole circle (at 0 0) (size 0.23 0.23) (drill 0.23) (layers *.Cu F.Mask))
(pad 21 smd rect (at 0 0) (size 1.75 1.75) (layers B.Cu)
(solder_paste_margin_ratio -0.08500000000000001))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/UQFN-20-1EP_3x3mm_Pitch0.4mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
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