Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the...

Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the solder paste dimensions

dvk-mx8m-bsb.pretty/PTN5110.kicad_mod

-(module PTN5110 (layer F.Cu) (tedit 5B21A615)
+(module PTN5110 (layer F.Cu) (tedit 5B295AC0)
+  (descr https://www.nxp.com/docs/en/data-sheet/PTN5110_SDS.pdf)
   (tags "USB PD TCPC PHY IC")
   (solder_mask_margin 0.05)
   (solder_paste_margin -0.025)
@@ -18,14 +19,14 @@
   (fp_line (start 1.3 1.3) (end 1.3 -1.3) (layer Dwgs.User) (width 0.05))
   (fp_line (start -1.3 1.3) (end 1.3 1.3) (layer Dwgs.User) (width 0.05))
   (fp_line (start -1.3 -1.3) (end -1.3 1.3) (layer Dwgs.User) (width 0.05))
-  (fp_line (start -1.4 -1.4) (end -0.6 -1.4) (layer F.SilkS) (width 0.15))
-  (fp_line (start -1.4 -1) (end -1.4 -1.4) (layer F.SilkS) (width 0.15))
-  (fp_line (start -1.4 1.4) (end -1.4 1) (layer F.SilkS) (width 0.15))
-  (fp_line (start -0.6 1.4) (end -1.4 1.4) (layer F.SilkS) (width 0.15))
-  (fp_line (start 1.4 1.4) (end 0.6 1.4) (layer F.SilkS) (width 0.15))
-  (fp_line (start 1.4 1) (end 1.4 1.4) (layer F.SilkS) (width 0.15))
-  (fp_line (start 1.4 -1.4) (end 1.4 -1) (layer F.SilkS) (width 0.15))
-  (fp_line (start 1.4 -1.4) (end 0.6 -1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.4 -1.4) (end -0.65 -1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.4 -1.05) (end -1.4 -1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.4 1.4) (end -1.4 1.05) (layer F.SilkS) (width 0.15))
+  (fp_line (start -0.65 1.4) (end -1.4 1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.4 1.4) (end 0.65 1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.4 1.05) (end 1.4 1.4) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.4 -1.4) (end 1.4 -1.05) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.4 -1.4) (end 0.65 -1.4) (layer F.SilkS) (width 0.15))
   (fp_circle (center -1.75 -1.25) (end -1.75 -1.175) (layer F.SilkS) (width 0.15))
   (fp_line (start -1.425 1.025) (end -1.925 1.025) (layer F.Fab) (width 0.05))
   (fp_line (start -1.425 1.425) (end -1.425 1.025) (layer F.Fab) (width 0.05))
@@ -58,5 +59,7 @@
   (pad 15 smd rect (at 0 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask))
   (pad 16 smd rect (at -0.4 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask))
   (pad 17 smd rect (at 0 0) (size 1.1 1) (layers F.Cu F.Paste F.Mask)
-    (solder_paste_margin -0.25))
+    (solder_paste_margin -0.000001) (solder_paste_margin_ratio -0.08))
+  (pad 17 thru_hole circle (at -0.3 -0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
+  (pad 17 thru_hole circle (at 0.3 0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
 )