Commit 70538ce7 authored by Eric Kuzmenko's avatar Eric Kuzmenko
Browse files

Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the...

Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the solder paste dimensions
parent 3fc44dc1
(module PTN5110 (layer F.Cu) (tedit 5B21A615) (module PTN5110 (layer F.Cu) (tedit 5B295AC0)
(descr https://www.nxp.com/docs/en/data-sheet/PTN5110_SDS.pdf)
(tags "USB PD TCPC PHY IC") (tags "USB PD TCPC PHY IC")
(solder_mask_margin 0.05) (solder_mask_margin 0.05)
(solder_paste_margin -0.025) (solder_paste_margin -0.025)
...@@ -18,14 +19,14 @@ ...@@ -18,14 +19,14 @@
(fp_line (start 1.3 1.3) (end 1.3 -1.3) (layer Dwgs.User) (width 0.05)) (fp_line (start 1.3 1.3) (end 1.3 -1.3) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.3 1.3) (end 1.3 1.3) (layer Dwgs.User) (width 0.05)) (fp_line (start -1.3 1.3) (end 1.3 1.3) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.3 -1.3) (end -1.3 1.3) (layer Dwgs.User) (width 0.05)) (fp_line (start -1.3 -1.3) (end -1.3 1.3) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 -1.4) (end -0.6 -1.4) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 -1.4) (end -0.65 -1.4) (layer F.SilkS) (width 0.15))
(fp_line (start -1.4 -1) (end -1.4 -1.4) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 -1.05) (end -1.4 -1.4) (layer F.SilkS) (width 0.15))
(fp_line (start -1.4 1.4) (end -1.4 1) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 1.4) (end -1.4 1.05) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 1.4) (end -1.4 1.4) (layer F.SilkS) (width 0.15)) (fp_line (start -0.65 1.4) (end -1.4 1.4) (layer F.SilkS) (width 0.15))
(fp_line (start 1.4 1.4) (end 0.6 1.4) (layer F.SilkS) (width 0.15)) (fp_line (start 1.4 1.4) (end 0.65 1.4) (layer F.SilkS) (width 0.15))
(fp_line (start 1.4 1) (end 1.4 1.4) (layer F.SilkS) (width 0.15)) (fp_line (start 1.4 1.05) (end 1.4 1.4) (layer F.SilkS) (width 0.15))
(fp_line (start 1.4 -1.4) (end 1.4 -1) (layer F.SilkS) (width 0.15)) (fp_line (start 1.4 -1.4) (end 1.4 -1.05) (layer F.SilkS) (width 0.15))
(fp_line (start 1.4 -1.4) (end 0.6 -1.4) (layer F.SilkS) (width 0.15)) (fp_line (start 1.4 -1.4) (end 0.65 -1.4) (layer F.SilkS) (width 0.15))
(fp_circle (center -1.75 -1.25) (end -1.75 -1.175) (layer F.SilkS) (width 0.15)) (fp_circle (center -1.75 -1.25) (end -1.75 -1.175) (layer F.SilkS) (width 0.15))
(fp_line (start -1.425 1.025) (end -1.925 1.025) (layer F.Fab) (width 0.05)) (fp_line (start -1.425 1.025) (end -1.925 1.025) (layer F.Fab) (width 0.05))
(fp_line (start -1.425 1.425) (end -1.425 1.025) (layer F.Fab) (width 0.05)) (fp_line (start -1.425 1.425) (end -1.425 1.025) (layer F.Fab) (width 0.05))
...@@ -58,5 +59,7 @@ ...@@ -58,5 +59,7 @@
(pad 15 smd rect (at 0 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask)) (pad 15 smd rect (at 0 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -0.4 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask)) (pad 16 smd rect (at -0.4 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 1.1 1) (layers F.Cu F.Paste F.Mask) (pad 17 smd rect (at 0 0) (size 1.1 1) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.25)) (solder_paste_margin -0.000001) (solder_paste_margin_ratio -0.08))
(pad 17 thru_hole circle (at -0.3 -0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
(pad 17 thru_hole circle (at 0.3 0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
) )
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