Add 0.3mm diameter thermal relief via to the AP22814 footprint's exposed pad

dvk-mx8m-bsb.pretty/AP22814.kicad_mod

-(module AP22814 (layer F.Cu) (tedit 5B22ECBC)
+(module AP22814 (layer F.Cu) (tedit 5B29F1B2)
   (fp_text reference REF** (at 0 -2) (layer F.SilkS)
     (effects (font (size 1 1) (thickness 0.15)))
   )
@@ -26,6 +26,7 @@
   (pad 3 smd rect (at 0.65 0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
   (pad 4 smd rect (at 0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
   (pad 6 smd rect (at -0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
+  (pad 2 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
   (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-6-1EP_2x2mm_Pitch0.65mm.wrl
     (at (xyz 0 0 0))
     (scale (xyz 1 1 1))