Commit b5e14e25 authored by Eric Kuzmenko's avatar Eric Kuzmenko
Browse files

Add 0.3mm diameter thermal relief via to the AP22814 footprint's exposed pad

parent 4a32dae1
(module AP22814 (layer F.Cu) (tedit 5B22ECBC)
(module AP22814 (layer F.Cu) (tedit 5B29F1B2)
(fp_text reference REF** (at 0 -2) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
......@@ -26,6 +26,7 @@
(pad 3 smd rect (at 0.65 0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at 0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -0.65 -0.825) (size 0.37 0.45) (layers F.Cu F.Paste F.Mask))
(pad 2 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-6-1EP_2x2mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
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