Commit cffaded9 authored by Eric Kuzmenko's avatar Eric Kuzmenko
Browse files

Route the VBAT_REG output to the In3.Cu layers, begin placing the passive...

Route the VBAT_REG output to the In3.Cu layers, begin placing the passive components around the TCPC PHY chip (same placement positions as EmCraft's), add SIM card slot 3D model and move it onto the PCB area
parent 58739bbe
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(module BQ25896 (layer F.Cu) (tedit 5B36FF74)
(module BQ25896 (layer F.Cu) (tedit 5B457AFF)
(solder_mask_margin 0.07)
(solder_paste_margin -0.025)
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
......@@ -78,15 +78,15 @@
(pad 25 smd rect (at 0.7 -0.7) (size 1.15 1.15) (layers F.Paste))
(pad 25 smd rect (at 0.7 0.7) (size 1.15 1.15) (layers F.Paste))
(pad 25 smd rect (at -0.7 0.7) (size 1.15 1.15) (layers F.Paste))
(pad 25 thru_hole circle (at -0.9 -0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at -0.9 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at -0.9 0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 -0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 -0.9) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at -0.9 -0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at -0.9 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at -0.9 0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0.9 -0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 -0.9) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(pad 25 thru_hole circle (at 0 0) (size 0.3 0.3) (drill 0.3) (layers *.Cu F.Mask))
(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
(module JAE_SF56 (layer F.Cu) (tedit 5B28E0FD)
(module JAE_SF56 (layer F.Cu) (tedit 5B45A402)
(attr smd)
(fp_text reference JAE_SF56 (at 0 -9.3) (layer Eco1.User)
(effects (font (size 1 1) (thickness 0.05)))
(fp_text reference REF** (at 0 -9) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value VAL** (at 0 9.4) (layer F.SilkS)
(effects (font (size 1.004 1) (thickness 0.05)))
(fp_text value JAE_SF56 (at 0 9) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 3.4 2.8) (end 3.4 4.1) (layer Dwgs.User) (width 0.15))
(fp_line (start -2.5 2.9) (end -2.5 4) (layer Dwgs.User) (width 0.15))
......@@ -79,4 +79,9 @@
(pad HD3 smd rect (at 2.87 -7.45) (size 1.75 1.3) (layers F.Cu F.Paste F.Mask))
(pad HD1 smd rect (at -6.8 7.4 90) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask))
(pad HD4 smd rect (at 6.9 7.55 90) (size 1.1 1) (layers F.Cu F.Paste F.Mask))
(model ${KIPRJMOD}/packages3d/SF56S006V4BR2000.wrl
(at (xyz 0 0 0.048))
(scale (xyz 0.3925 0.3925 0.3925))
(rotate (xyz 270 0 0))
)
)
(module PTN36043 (layer F.Cu) (tedit 5B21AD3A)
(module PTN36043 (layer F.Cu) (tedit 5B457B36)
(tags "USB Type-C SuperSpeed active switch")
(solder_mask_margin 0.05)
(clearance 0.1)
......@@ -42,7 +42,7 @@
(pad 5 smd rect (at -0.8 1.05) (size 0.2 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 0 0) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.5))
(pad 19 thru_hole circle (at 0 -0.45) (size 0.3 0.3) (drill 0.2) (layers *.Cu *.Mask))
(pad 19 thru_hole circle (at 0 0.45) (size 0.3 0.3) (drill 0.2) (layers *.Cu *.Mask))
(pad 19 thru_hole circle (at 0 -0.45) (size 0.2 0.2) (drill 0.2) (layers *.Cu F.Mask))
(pad 19 thru_hole circle (at 0 0.45) (size 0.2 0.2) (drill 0.2) (layers *.Cu F.Mask))
(pad 19 smd rect (at 0 0) (size 0.95 1.3) (layers F.Paste))
)
(module PTN5110 (layer F.Cu) (tedit 5B295AC0)
(module PTN5110 (layer F.Cu) (tedit 5B457B64)
(descr https://www.nxp.com/docs/en/data-sheet/PTN5110_SDS.pdf)
(tags "USB PD TCPC PHY IC")
(solder_mask_margin 0.05)
......@@ -60,6 +60,6 @@
(pad 16 smd rect (at -0.4 -1.35) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 1.1 1) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.000001) (solder_paste_margin_ratio -0.08))
(pad 17 thru_hole circle (at -0.3 -0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
(pad 17 thru_hole circle (at 0.3 0.2) (size 0.4 0.4) (drill 0.254) (layers *.Cu *.Mask))
(pad 17 thru_hole circle (at -0.3 -0.2) (size 0.254 0.254) (drill 0.254) (layers *.Cu F.Mask))
(pad 17 thru_hole circle (at 0.3 0.2) (size 0.254 0.254) (drill 0.254) (layers *.Cu F.Mask))
)
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