Commit e6918e00 authored by Eric Kuzmenko's avatar Eric Kuzmenko
Browse files

Add thermal vias to RT8070's exposed pad

parent aee60871
(module RT8070 (layer F.Cu) (tedit 5B25F157)
(module RT8070 (layer F.Cu) (tedit 5B29EAAC)
(descr https://www.richtek.com/assets/podfiles/PT-000014_FOOTPRINT.pdf)
(tags RT8070)
(solder_mask_margin 0.05)
(attr smd)
(fp_text reference RT8070 (at 0 4) (layer F.Fab)
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value REF** (at 0 -4) (layer F.SilkS)
(fp_text value RT8070 (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -4.25 -1.905) (end -4.25 -1.805) (layer F.SilkS) (width 0.2))
(fp_line (start -2 -2.5) (end 2 -2.5) (layer Dwgs.User) (width 0.127))
(fp_line (start -2 2.5) (end 2 2.5) (layer Dwgs.User) (width 0.127))
(fp_line (start -2 -2.5) (end 2 -2.5) (layer F.SilkS) (width 0.127))
(fp_line (start -2 2.5) (end 2 2.5) (layer F.SilkS) (width 0.127))
(fp_line (start -2 -2.5) (end -2 2.5) (layer Dwgs.User) (width 0.127))
(fp_line (start 2 -2.5) (end 2 2.5) (layer Dwgs.User) (width 0.127))
(fp_line (start -3.71 -2.76) (end 3.71 -2.76) (layer Dwgs.User) (width 0.05))
(fp_line (start -3.71 2.76) (end 3.71 2.76) (layer Dwgs.User) (width 0.05))
(fp_line (start -3.71 -2.76) (end -3.71 2.76) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.71 -2.76) (end 3.71 2.76) (layer Dwgs.User) (width 0.05))
(pad 1 smd rect (at -2.75 -1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.75 -0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.75 0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.75 1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.75 1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.75 0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 2.75 -0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 2.75 -1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 2.3 2.3) (layers F.Cu F.Paste F.Mask))
(model ${KIPRJMOD}/packages3d/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.35x2.35mm.wrl
(fp_circle (center -3.75 -1.905) (end -3.75 -1.83) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.9 0.9) (thickness 0.135)))
)
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.75 -1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 2 smd rect (at -2.75 -0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 3 smd rect (at -2.75 0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 4 smd rect (at -2.75 1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 5 smd rect (at 2.75 1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 6 smd rect (at 2.75 0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 7 smd rect (at 2.75 -0.635) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 8 smd rect (at 2.75 -1.905) (size 1.3 0.7) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin -0.05))
(pad 9 smd rect (at 0.575 0.575) (size 1.15 1.15) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.14))
(pad 9 smd rect (at 0.575 -0.575) (size 1.15 1.15) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.14))
(pad 9 smd rect (at -0.575 0.575) (size 1.15 1.15) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.14))
(pad 9 smd rect (at -0.575 -0.575) (size 1.15 1.15) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.14))
(pad 9 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 -0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 -0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at 0.8 0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(pad 9 thru_hole circle (at -0.8 0.8) (size 0.4 0.4) (drill 0.3) (layers *.Cu F.Mask))
(model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
......
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