Make the ETH PHY's crystal's load capacitors 27pF instead of 22pF, Cstray should now be 3.5pF instead of 7pF

Move USB-C, Mini-HDMI, RJ45, and 3.5mm jack receptacles to the bottom of the board, also place the Micro-SD card slot to the left of all of the receptacles centered at the bottom, place the Smart-Card slot just above the Micro-SD card facing the left, add 3D models to each of the respective connectors/sockets

The order of the various receptacles and sockets can be changed bit the pitch between them should stay about the same since it is currently as tightly packed asreasonably possible (1.5~2.5mm clearance between connectors).

Replace the tantalum capacitor that is AC-coupling the input of the class D amplifier with a ceramic 0603 cap

Replace resistors which have specific values that can be converted to more common values in order to reduce the total number of unique BoM line items

Replace the VCNL4040 proximity+ambient light sensor's 470nF bypass cap on VDD with a 1uF one to reduce the number of BoM line items, also replace the USB Hub+SDIO bridge chip's SDCD cap between the P-MOSFET's gate and drain with an 18pF capacitor instead of a 10pF for the same reason (reduce number of BoM line items)

Make some minor fixes to various components' properties and update the BoM with the respective changes, sort the BoM based on reference designator and value

Replace SZMM5Z3V3T1G with MMSZ4688 zener diode which has a higher reverse working voltage to ensure that HP_DET is at a strong HIGH level when headphones/headset are inserted into the jack, replace its SOD-523 footprint with the corresponding SOD-123 footprint from the spec sheet's recommended land pattern

Add pin 1 indicator and silkscreen boarder to the SoM connector footprint, apply the respective change to the layout

Make AR8031's reference designator on the silkscreen layer above the land pattern and its value on the F.Fab layer below the land pattern, make the fiducials' B.Cu pad have the back mask exposed, apply these footprint changes to the footprints in the layout

 later, add track and via sizes used from EmCraft's baseboard design into the global design rules, change JH057N00900 outline from F.Fab to Dwgs.User

Replace camera's schottky+resistor level-shifter circuit with the more functional TXB0101 dedicated IC

Change GRM219R61C226ME15L X5R 0805 22uF capacitor to being a CL10A226MP8NUNE X5R 0603 22uF capacitor

Make the fill background on the  haptic motor schematic symbol like the rest of the external components throughout the schematic

Import netlist into Pcbnew layout software, spread out all footprints to prepare for placing components in their respective locations and begin routing

Make mpcie-outline footprint's back silkscreen pads graphic line rectangles to prevent errors in layout

Assign placeholder footprints to WWAN antennae (identical to GNSS ones for now), add haptic motor schematic symbol and split up the connector and motor footprints, now ready to generate netlist and import it into Pcbew without errors

Add proper WWAN reset circuit using a MMBT2222A NPN BJT along with a 100nF cap and a TVS diode, make needed adjustements to the WWAN's SIM card circuit (UIM-CLK and UIM-RESET caps are NC & added 4.7k series resistor to SIM_DETECT_O#), assign the MMBT2222A footprint to KiCad's official SOT-23 footprint (identical to the spec sheet's recommended land pattern)

If necessary, the NC cap pads on UIM-CLK and UIM-RESET can be tested with various values during the first prototype debugging phase.

Add pull-up resistor to nCS pin of the NOR flash chip, make electrolytic caps tantalums again due to a the price difference not being significant

Adjust the SoM outline footprint by rotating it 90 degrees and making the reference and value text the standard size (reference is now invisible), did the same for the SoM connector footprint (reference is visible), added baseboard connector 3D model to the EmCr_SOM_IMX8M_Connector footprint, removed the P1 connector from the SoM 3D model since P1 is now assigned to the EmCr_SOM_IMX8M_Connector footprint