- 02 Aug, 2018 1 commit
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Eric Kuzmenko authored
Route USB2 to the hub chip's upstream port and re-order & route each of the downstream ports to their respective locations (smartcard, mPCIe, & M.2), place and route the HDMI fuse, schottky diodes, TVS diodes, capacitors, and pull-up resistors, route the rest of the HDMI's interface to the SoM (HPD & I2C), adjust the GNSS antenna's CPW width using the PCB manufacturer's recommendation from their calculations The HDMI circuit should be complete now. The GNSS & WiFi+BT antennae should also be complete. The GNSS module's RX & TX lines need to be routed next.
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- 01 Aug, 2018 2 commits
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Eric Kuzmenko authored
Add ANT-LTE-CER-T as the baseband modem antenna into the schematic and BoM, update the layout accordingly
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Eric Kuzmenko authored
The diff pairs going to the NFETs are exactly matched to 0 with their phase/skew; 1V8P still needs to be brought to them.
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- 30 Jul, 2018 1 commit
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Eric Kuzmenko authored
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- 28 Jul, 2018 2 commits
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Eric Kuzmenko authored
Coarsely route HDMI diff pairs from the SoM to the CMF&ESD chips, place the microphone in a position that does not interfere with either the HDMI circuit or the RJ45 The HDMI diff pairs will need to try to have 30mil clearance between each other at every point possible, in tight spaces this is not possible, even spacing will need to be adjusted in the following commit.
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Eric Kuzmenko authored
Needed to create the HDMI_HEAC_P/N labels to route Utility&HPD as diff pairs. Made cap C1905 NC, which is in parallel with a 0Ohm resistor between the HDMI sheilding and GND.
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- 27 Jul, 2018 1 commit
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Eric Kuzmenko authored
Place and route the BOOT_CFG* signals, correct a signal labelling mistake causing SAI1_RXD0 (BOOT_CFG00) to be connected to SAI1_TXD0 (BOOT_CFG08) BOOT_MODE* still needs to be placed & routed, need to find a good location for the SMD slide switches.
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- 26 Jul, 2018 1 commit
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Eric Kuzmenko authored
Add WiFi+BT antenna footprint, add pi matching circuit to the WiFi+BT antennas' feedlines, increment the capacitor part numbers on page 18 after adding the new (NC) feedline caps and make the respective changes to the reference designators in the BoM
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- 24 Jul, 2018 1 commit
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Eric Kuzmenko authored
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- 20 Jul, 2018 1 commit
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Eric Kuzmenko authored
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- 19 Jul, 2018 2 commits
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Eric Kuzmenko authored
Add new built-in mic's frequency response curve to the schematic and re-simulate the HP_DET pin circuit with the protection diode's SPICE model included
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Eric Kuzmenko authored
Replace the CMC-6022-37T microphoen with the CMC-2242PBL-A THT one since the old one cannot be surface mounted/reflowed, add the microphone's 3D model The microphone's pin position/order is agrees with the manufacturer's "measurement circuit" from the datasheet such that the right (facing the top of the mic) terminal/pin is its GND (-).
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- 17 Jul, 2018 1 commit
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Eric Kuzmenko authored
Update the schematic symbols and footprints after upgrading to KiCad 5.0.0, fix all ERC and DRC violations after the new update/upgrade
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- 16 Jul, 2018 2 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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- 14 Jul, 2018 1 commit
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Eric Kuzmenko authored
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- 09 Jul, 2018 2 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Since each of these ICs will be powered at the same time as the SoM regardless of the PWR_EN state, they should share the same I2C bus as the PMIC.
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- 05 Jul, 2018 2 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Emcraft is also going to change this cap to 2.2uF.
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- 04 Jul, 2018 1 commit
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Eric Kuzmenko authored
Now using GPIO5_IO03 (P4.03) to put the class-D op-amp in shutdown and conserve energy when muted, make C1716 near the ETH PHY's DVDDL pin 47 220nF instead of 10uF (EmCraft suggested that this should be 100nF but their's is 220nF, asked why), added a 10k pull-down to PAM2841's ENA pin, added a 100nF cap to the smart card's C1 VCC pin, added a 1uF cap to the haptic motor circuit's 3V3_P rail Still need to use I2C3 instead of I2C1 according to EmCraft's suggestions.
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- 03 Jul, 2018 3 commits
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Eric Kuzmenko authored
Move the VBUS TVS diode and bypass caps and place copper pour on the respective pad areas, the VBUS rail has a 6mm wide fill zone in order to properly handle ~4.3A with a <10degreeC temperature rise (should also do this when bring VBUS to the charge controller), make the In4.Cu layer a solid ground layer
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Eric Kuzmenko authored
Move CAPTOUCH_~RST from BOOT_CFG_03 to GPIO1_IO05/P3.33 (was CSI_P2_PWDN), add a 10k pull-down to LCD_~RESET, make the corresponding changes to the BoM and netlist/layout Having CAPTOUCH_~RST on BOOT_CFG_03 caused a voltage divider on the pin.
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Eric Kuzmenko authored
Route the PTC polyfuse that's on the VBUS rail using a copper pour on the In4.Cu layer, route the USB-C's shielding to parallel 0Ohm and NC cap to GND, add a power net class, add a 0.508mm annular ring 0.254mm drill via for power nets
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- 02 Jul, 2018 1 commit
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Eric Kuzmenko authored
Re-route the differential tracks going from the USB-C switch IC to the EMI&TVS ICs along with some of the passives around the USB-C switch chip (similar placement to EmCraft's), add a 1uF cap to the EN pin of the 2.8V LDO in order to introduce a small (~10ms) delay between the 1.8V rail coming up and the 2.8V rail
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- 30 Jun, 2018 1 commit
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Eric Kuzmenko authored
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- 29 Jun, 2018 3 commits
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Eric Kuzmenko authored
Rename all diff pairs such that they end in _P/_N rather than just P/N (underscore needed for diff pair routing)
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Eric Kuzmenko authored
Make the ETH PHY's crystal's load capacitors 27pF instead of 22pF, Cstray should now be 3.5pF instead of 7pF
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Eric Kuzmenko authored
Move USB-C, Mini-HDMI, RJ45, and 3.5mm jack receptacles to the bottom of the board, also place the Micro-SD card slot to the left of all of the receptacles centered at the bottom, place the Smart-Card slot just above the Micro-SD card facing the left, add 3D models to each of the respective connectors/sockets The order of the various receptacles and sockets can be changed bit the pitch between them should stay about the same since it is currently as tightly packed asreasonably possible (1.5~2.5mm clearance between connectors).
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- 28 Jun, 2018 5 commits
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Eric Kuzmenko authored
Replace resistors which have specific values that can be converted to more common values in order to reduce the total number of unique BoM line items
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Replace the VCNL4040 proximity+ambient light sensor's 470nF bypass cap on VDD with a 1uF one to reduce the number of BoM line items, also replace the USB Hub+SDIO bridge chip's SDCD cap between the P-MOSFET's gate and drain with an 18pF capacitor instead of a 10pF for the same reason (reduce number of BoM line items)
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Make some minor fixes to various components' properties and update the BoM with the respective changes, sort the BoM based on reference designator and value
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- 27 Jun, 2018 2 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Replace SZMM5Z3V3T1G with MMSZ4688 zener diode which has a higher reverse working voltage to ensure that HP_DET is at a strong HIGH level when headphones/headset are inserted into the jack, replace its SOD-523 footprint with the corresponding SOD-123 footprint from the spec sheet's recommended land pattern
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- 26 Jun, 2018 1 commit
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Eric Kuzmenko authored
Replace camera's schottky+resistor level-shifter circuit with the more functional TXB0101 dedicated IC
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- 25 Jun, 2018 3 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Assign placeholder footprints to WWAN antennae (identical to GNSS ones for now), add haptic motor schematic symbol and split up the connector and motor footprints, now ready to generate netlist and import it into Pcbew without errors
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