GitLab

Replace logic gate packages with cheaper options, change associated footprints to ones which match the cheaper alternatives

Added additional XOR gate to the WWAN page. This makes it possible that the polarity of the SIM_DETECT signal is configurable by one single O-Ohm-resistor.
This adds more flexibility concerning modem choice, as there are both polarities of this signal used by different modem manufacturers.
Added placeholder symbol for modem card (which holds now datasheet/bom information). The MPCIE socket has datasheet information, too.
Picked two electrolytic capacitors (220uF/10V) by Panasonic by distributor TME.

Replace WWAN M.2 circuit with one intended for mPCIe modules, include 74LVC1G08 single 2-input AND gate, create the AND gate's footprint and use the official SOT-23-5 3D model

The mini-SIM slot will need to be replaced with one that has an active-LOW detection pin. Will want to see if we can find cheap electrolytic to replace a few of the tantalum caps with (not all since we still need some low ESR, high capacitance, low profile, caps).

Datasheet links and supplier information can be stored in these new library symbols.

Add silkscreen dot to all footprints which are missing one that need them to determine IC orientation

MX25L1606EZNI's land description explicitly states "Avoid placing vias or traces underneath the metal pad." This means that the exposed pad will need to be connected to ground through the top layer (and vias in other locations on the board, not at the exposed pad).

Add FDV301N footprint based on the manufacturer's given recommended land pattern, use lower ESR 220uF tantalum capacitors in place of previously selected ones, re-export the BoM

Double checked FET footprints to make sure those assigned to the official SOT-23 footprint are correct.

The 3D model is actually associated with the narrower package and can be considered a temporary placeholder.

Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the solder paste dimensions

The only difference between these two part numbers is the reel the chip comes in, both are identical ICs.

Changes in library symbol and footprint of J1503 (micro-SIM-connector). Differences prevented real connections of footprint pads.

Center the GNSS chip antenna on it's footprint design to make sure it's component coordinates are correct, add WLAN+BT placeholder footprint which is identical to the GNSS one (still needs to be selected)

The WWAN/BB chip antenna is likely going to be significantly different than the GNSS one (in terms of design and area) so it is not currently being used as a placeholder for it.

Create SN74LVC1G332DCKR footprint based on the manufacturer's given example and assign it to the respective schematic symbol, assign it the official KiCad SC-70-6 3D model

Create and assign SEC1110's footprint, assign it KiCad's offical QFN-16-1EP_5x5mm_Pitch0.8mm 3D model

Create SGTL5000XNLA3R2 footprint and assign it KiCad's official UQFN-20-1EP_3x3mm_Pitch0.4mm 3D model