Re-route the USB hub + SD controller chip's DP0/DM0 as a 90Ohm diff pair which feeds back to the IC's DM/DP pins (17<->31 & 18<->32), re-route the WWAN and WLAN diff pairs after they were shoved in a previous commit (reapplied the meanders as well)

Re-lay out parts of the 1V8_P buck converter circuit to follow a recommended layout, move the 2V8_P LDO circuit away from under the camera and place it on the back side of the board (display side) where the M.2 card will be on the other side where there is plenty of room

* LDO 2.8 V
* Buck converter 1.8V
* Touch controller connector + level shifters
* changes in layer In3.Cu to distribute supply voltages

Complete the 5V_P zone shape creation/drawing along with its vias and bring 5V_P to all of its loads

Still need to route the rest of the power circuit, the touch controller connector, move the ambient light/proximity sensor to the top, and clean everything up more

Correct a typo that was made on the SoM outline footprint's MH1 drill size (3.37mm instead of 3.73mm)

EmCraft's baseboard is actually using imperial units so it's actually a 3.7084mm hole

Re-route and clean up the DSI diff pairs, exactly match their intra-pair skew/phase as well as each of their lengths (data pairs and clock all having the same length)

Tuned for length (55 mm) and for skew/phase of each pair.

Layout & route the 5V_SOM boost converter circuit and begin laying out the 5V_P power swtich/rail circuit

Add serpentine bends to the CSI traces in order to match their intra-pair skew and make it exactly 0

Move the microphone downward out of the way of the display and re-place and re-route the HDMI components and traces which become obstructed by this new microphone placement

Moved display to center of board (y=148,5).
This makes access to the DSI FPC very easy, but causes trouble with microphone position.

Created by scanning the display and then editing the image with gimp and inkscape.

Place and route the JTAG circuit, place and route the BOOT_MODE slide switch circuit, place and route the user-LED circuit, place and route the top-level sheet passive components (I2C2 pull-ups, 5V_SOM, 3V3_OUT, & ENET_2V5 bypass caps, PWR_EN pull-down, USB2_VBUS voltage divider for SoC's comparator, etc), route the microphone to the analog audio switch IC, update the schematic, BoM, and footprints to reflect the MHF4 coax cable change (including them being 5cm long)

Unrouted count is now 324. The power circuit and the display are what is now left to be placed on the board, a few nets currently on the board still need to be connected (~120). 3V3_SNVS and various other misc. power rails still need to be routed on the power plane (vias need to be placed near pads).

JTAG header footprint is accessible from the display side (not underneath the display). User-LED is in a location as-close-as-possible to the bottom center of the board (somewhat near the microphone).

Serpentine bends still need to be added to the CSI to match the intra-pair skew, still need to move the prox sensor to the top of the board!

Fix a small formating mistake in the BoM and correct the DRC error in the layout (move the position of the DSI connector and the vias conflicting with it)

The outline was extracted from a technical drawing in pdf format, then edited with inkscape.
With the python utitity "svg2mod" the drawing was imported into a kicad footprint.
More display details should be integrated, but manual corrections in svg file are necessary.

Added keepout zone in the M.2 socket to prevent this in the future.

Rotate the haptic motor in order to minimize its wires' proximity to the USB-C diff pairs on the back

Lay out the rest of the 3V3 and 3V3_P circuits, route the PWR_EN to the 3V3_P power switch IC, lay out & route the reset button's circuit

Begin routing the 3V3 buck converter circuit, make all SMD footprints defined as SMD footprints instead of THT

Unrouted count is now down to 543.

Route the rest of the camera circuit, add meanders to the clock and D1 diff pairs so that the skew between the clock and data-lines is 0 (still need to do intra-pair skew/phase), add the pull-up resistors to I2C3, add a 3V3_P filled zone around the whole board on the In3.Cu layer

Place and begin routing the camera, move the haptic motor to the "back" (side with the display) at a spot with its connector where there are no obstructions, move the slide switches to the "back-right" (front-left facing the display upright) and the ONOFF/volume buttons to the "front-left" (back-right facing the display upright)