- 03 Jul, 2018 6 commits
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Eric Kuzmenko authored
Move the VBUS TVS diode and bypass caps and place copper pour on the respective pad areas, the VBUS rail has a 6mm wide fill zone in order to properly handle ~4.3A with a <10degreeC temperature rise (should also do this when bring VBUS to the charge controller), make the In4.Cu layer a solid ground layer
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Eric Kuzmenko authored
Move CAPTOUCH_~RST from BOOT_CFG_03 to GPIO1_IO05/P3.33 (was CSI_P2_PWDN), add a 10k pull-down to LCD_~RESET, make the corresponding changes to the BoM and netlist/layout Having CAPTOUCH_~RST on BOOT_CFG_03 caused a voltage divider on the pin.
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Christian Schilmoeller authored
Make the EDGE CUTS rectangle a real milling in the pcb. (Only a memory aid that this is possible, also done inside the M.2 Cardholder footprint)
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Route the PTC polyfuse that's on the VBUS rail using a copper pour on the In4.Cu layer, route the USB-C's shielding to parallel 0Ohm and NC cap to GND, add a power net class, add a 0.508mm annular ring 0.254mm drill via for power nets
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Eric Kuzmenko authored
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- 02 Jul, 2018 5 commits
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Eric Kuzmenko authored
Re-route the differential tracks going from the USB-C switch IC to the EMI&TVS ICs along with some of the passives around the USB-C switch chip (similar placement to EmCraft's), add a 1uF cap to the EN pin of the 2.8V LDO in order to introduce a small (~10ms) delay between the 1.8V rail coming up and the 2.8V rail
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Eric Kuzmenko authored
Make some minor aesthetic adjustments to the USB-C schematic sheet, the USB-C receptacle symbol should come from the dvk-mx8m-bsb library
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Christian Schilmoeller authored
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Christian Schilmoeller authored
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Christian Schilmoeller authored
Routed some data lines behind USB connector.
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- 30 Jun, 2018 3 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Route the USB-C differential signals going from the EMI&TVS ICs to the receptacle, add meander/serpentine bends to tracks which need differential pair skew/phase tuning
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- 29 Jun, 2018 4 commits
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Eric Kuzmenko authored
Rename all diff pairs such that they end in _P/_N rather than just P/N (underscore needed for diff pair routing)
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Make the ETH PHY's crystal's load capacitors 27pF instead of 22pF, Cstray should now be 3.5pF instead of 7pF
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Eric Kuzmenko authored
Move USB-C, Mini-HDMI, RJ45, and 3.5mm jack receptacles to the bottom of the board, also place the Micro-SD card slot to the left of all of the receptacles centered at the bottom, place the Smart-Card slot just above the Micro-SD card facing the left, add 3D models to each of the respective connectors/sockets The order of the various receptacles and sockets can be changed bit the pitch between them should stay about the same since it is currently as tightly packed asreasonably possible (1.5~2.5mm clearance between connectors).
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- 28 Jun, 2018 11 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Replace the tantalum capacitor that is AC-coupling the input of the class D amplifier with a ceramic 0603 cap
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Eric Kuzmenko authored
Replace resistors which have specific values that can be converted to more common values in order to reduce the total number of unique BoM line items
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Replace the VCNL4040 proximity+ambient light sensor's 470nF bypass cap on VDD with a 1uF one to reduce the number of BoM line items, also replace the USB Hub+SDIO bridge chip's SDCD cap between the P-MOSFET's gate and drain with an 18pF capacitor instead of a 10pF for the same reason (reduce number of BoM line items)
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Make some minor fixes to various components' properties and update the BoM with the respective changes, sort the BoM based on reference designator and value
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- 27 Jun, 2018 3 commits
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Replace SZMM5Z3V3T1G with MMSZ4688 zener diode which has a higher reverse working voltage to ensure that HP_DET is at a strong HIGH level when headphones/headset are inserted into the jack, replace its SOD-523 footprint with the corresponding SOD-123 footprint from the spec sheet's recommended land pattern
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- 26 Jun, 2018 8 commits
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Eric Kuzmenko authored
Add pin 1 indicator and silkscreen boarder to the SoM connector footprint, apply the respective change to the layout
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
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Eric Kuzmenko authored
Make AR8031's reference designator on the silkscreen layer above the land pattern and its value on the F.Fab layer below the land pattern, make the fiducials' B.Cu pad have the back mask exposed, apply these footprint changes to the footprints in the layout
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Eric Kuzmenko authored
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