1. 02 Oct, 2018 2 commits
  2. 20 Sep, 2018 1 commit
  3. 24 Aug, 2018 1 commit
  4. 20 Aug, 2018 1 commit
  5. 16 Aug, 2018 2 commits
    • Eric Kuzmenko's avatar
      Update the BoM with all part numbers from the "purchasing" BoM in NextCloud,... · 274d2c99
      Eric Kuzmenko authored
      Update the BoM with all part numbers from the "purchasing" BoM in NextCloud, update all manufacturing-related files after the last few commits' changes (including new assembly & fabrication files as requested)
      274d2c99
    • Eric Kuzmenko's avatar
      Make the backlight boost converter compensation capacitor (C459) 10nF instead... · 9234b540
      Eric Kuzmenko authored
      Make the backlight boost converter compensation capacitor (C459) 10nF instead of 100nF (was a typo), make the charge controller's PMID capacitor (C302) 10uF instead of 8.2uF since it is a more common value and is what is being used on the charge controller's eval board, select a 10uF 0603 X5R capacitor rated for 25V for both the PMID cap and the 10uF cap on VBUS, update the .ods BoM with tolerances & ratings for the caps and resistors which will be supplied by the PCBA house, export the component-placement-list file (dvk-mx8m-bsb-all.pos) which gives the coordinates of all components with respect to the top-left fiducial mark, re-export the gerbers for preliminary review (add silkscreen which states that this is preliminary instead of a version number), make a few minor improvements to the board's routing in various spots, update the IMU footprint so that its silkscreen which gives the axis directions is visible on the board, some footprints were updated to be defined as SMD footprints in order to show up on the component-placement list (strictly through-hole components are not listed)
      
      The 0603 10uF 25V caps have been ordered and will be shipped to wherever the assembly is done. This commit contains the preliminary materials which will be reviewed (BoM, .pos file, and gerbers all zipped).
      9234b540
  6. 15 Aug, 2018 1 commit
    • Eric Kuzmenko's avatar
      Move some of the reference designators on the silkscreen layers to more... · 97f08f6a
      Eric Kuzmenko authored
      Move some of the reference designators on the silkscreen layers to more visible positions where possible, update the schematic, BoM, footprint, and layout to reflect the fact that the dual 2-input AND gate (U1803) is actually a 74AUP2G08* part (no longer *LVC*)
      
      The rest of the silkscreen designators still need to be placed in more visible/unobstructed locations. The BoM still needs to have tolerance & rating values enter for all passive components that will be supplied by the PCBA house.
      97f08f6a
  7. 11 Aug, 2018 2 commits
  8. 08 Aug, 2018 1 commit
    • Eric Kuzmenko's avatar
      Place and route the JTAG circuit, place and route the BOOT_MODE slide switch... · dde321d8
      Eric Kuzmenko authored
      Place and route the JTAG circuit, place and route the BOOT_MODE slide switch circuit, place and route the user-LED circuit, place and route the top-level sheet passive components (I2C2 pull-ups, 5V_SOM, 3V3_OUT, & ENET_2V5 bypass caps, PWR_EN pull-down, USB2_VBUS voltage divider for SoC's comparator, etc), route the microphone to the analog audio switch IC, update the schematic, BoM, and footprints to reflect the MHF4 coax cable change (including them being 5cm long)
      
      Unrouted count is now 324. The power circuit and the display are what is now left to be placed on the board, a few nets currently on the board still need to be connected (~120). 3V3_SNVS and various other misc. power rails still need to be routed on the power plane (vias need to be placed near pads).
      
      JTAG header footprint is accessible from the display side (not underneath the display). User-LED is in a location as-close-as-possible to the bottom center of the board (somewhat near the microphone).
      
      Serpentine bends still need to be added to the CSI to match the intra-pair skew, still need to move the prox sensor to the top of the board!
      dde321d8
  9. 07 Aug, 2018 1 commit
  10. 03 Aug, 2018 1 commit
    • Eric Kuzmenko's avatar
      Add pi-matching circuit to the baseband modem antenna's feedline · 2f8fb756
      Eric Kuzmenko authored
      The return path for the antenna may have to have a 6.8nH Murata LQG15HN inductor installed on it (cutting the ground trace shorting the pads). The BoM was updated with the new components and everything was reannotated and updated (page 2's caps were out of order).
      2f8fb756
  11. 02 Aug, 2018 1 commit
  12. 01 Aug, 2018 1 commit
  13. 30 Jul, 2018 1 commit
  14. 28 Jul, 2018 1 commit
    • Eric Kuzmenko's avatar
      Begin routing the HDMI circuit · 8c2544ff
      Eric Kuzmenko authored
      Needed to create the HDMI_HEAC_P/N labels to route Utility&HPD as diff pairs. Made cap C1905 NC, which is in parallel with a 0Ohm resistor between the HDMI sheilding and GND.
      8c2544ff
  15. 27 Jul, 2018 1 commit
  16. 26 Jul, 2018 2 commits
  17. 23 Jul, 2018 1 commit
  18. 19 Jul, 2018 2 commits
  19. 16 Jul, 2018 1 commit
  20. 11 Jul, 2018 1 commit
    • Eric Kuzmenko's avatar
      Replace the 103HT NTC thermistor with a ERTJ1VG103FA as found in TI's... · 2a2eba5c
      Eric Kuzmenko authored
      Replace the 103HT NTC thermistor with a ERTJ1VG103FA as found in TI's TIDA-01182 eval board which has a charge controller IC from the same family and uses an 18650 battery, change is due to it being smaller, cheaper, and has the same B value as the recommended thermistor in the charge controller IC's datasheet, comparing the thermistors' tables shows that they are nearly identical and that it should be a drop-in replacement
      2a2eba5c
  21. 09 Jul, 2018 1 commit
  22. 05 Jul, 2018 1 commit
  23. 04 Jul, 2018 1 commit
    • Eric Kuzmenko's avatar
      Now using GPIO5_IO03 (P4.03) to put the class-D op-amp in shutdown and... · 3bf0094e
      Eric Kuzmenko authored
      Now using GPIO5_IO03 (P4.03) to put the class-D op-amp in shutdown and conserve energy when muted, make C1716 near the ETH PHY's DVDDL pin 47 220nF instead of 10uF (EmCraft suggested that this should be 100nF but their's is 220nF, asked why), added a 10k pull-down to PAM2841's ENA pin, added a 100nF cap to the smart card's C1 VCC pin, added a 1uF cap to the haptic motor circuit's 3V3_P rail
      
      Still need to use I2C3 instead of I2C1 according to EmCraft's suggestions.
      3bf0094e
  24. 03 Jul, 2018 2 commits
  25. 29 Jun, 2018 1 commit
  26. 28 Jun, 2018 3 commits