Make use MIC5365's SC-70-5 package instead of the SOT-23-5 package since it is a lower cost and is more available, assign it the official SC-70-5 3D model

Used Microchip's "Package Specification" document which on page 41 shows the recommended land pattern for their SC-70-5 packages (nominal pad dimensions are given but spacing is shown as min/max, used these values +/- 0.05mm for headroom).