Commit d30c5fd1 authored by Eric Kuzmenko's avatar Eric Kuzmenko

Modify the antennas' feedlines for a 1.1mm nominal thickness board using a relat

ive permittivity of 4.1~4.11

The H parameter in the calculations was +0.21mm greater than the H used in the p
rototype calculations (1.1mm thick board instead of 0.89mm thick)

A DK value of 4.11 was used for the GNSS and WWAN antennae feedlines and a DK of 4.1 was used for the Wi-Fi/BT feedlines since the operating frequency of the GNSS and WWAN is generally a bit lower than Wi-Fi/BT.

The NANYA NP-180TL spec sheet is also included. The specific prepreg/core/substrate/dielectric used is NANYA NP-180**TL** which has a DK specified as 4.1-4.3 @ 1GHz.
parent 199f75a2
......@@ -59,7 +59,7 @@
(user_trace_width 0.381)
(user_trace_width 0.4572)
(trace_clearance 0.127)
(zone_clearance 0.13001)
(zone_clearance 0.253)
(zone_45_only no)
(trace_min 0.089154)
(segment_width 0.3)
......@@ -1404,6 +1404,251 @@
(add_net /USB-C/CC2)
)
(module dvk-mx8m-bsb:ACM4-5036-A1-CC-S locked (layer F.Cu) (tedit 5BD9DB17) (tstamp 5B9649FE)
(at 118 60.9 270)
(tags "Chip Antenna")
(path /5B0D6F7B/5B123EED)
(solder_mask_margin 0.000001)
(attr smd)
(fp_text reference AE2301 (at 3.1 2.1) (layer F.SilkS)
(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value ACM4-5036-A1-CC-S (at 1.525 5.075 270) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
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(fp_line (start 0.25 1.15) (end -0.75 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 0.7) (end 1.9 2.7) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.05 -0.25) (end 1.65 2.15) (layer Dwgs.User) (width 0.05))
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)
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(fp_line (start 1.875 -3.275) (end -1.875 -3.275) (layer F.Fab) (width 0.1))
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(fp_line (start -1.875 3.275) (end 1.875 3.275) (layer F.Fab) (width 0.1))
(fp_line (start 1.875 3.275) (end 1.875 -3.275) (layer F.Fab) (width 0.1))
(fp_circle (center 0 3.025) (end 0.075 3.025) (layer F.Fab) (width 0.15))
(fp_text user %R (at 0 0 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 2 smd rect (at 4.4 5.3885 270) (size 1 10.823) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 1.25 10.3 270) (size 7.3 1) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 4.4 -3.9385 270) (size 1 4.523) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 1.25 -5.7 270) (size 7.3 1) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at -1.9 -4.175 270) (size 1 4.05) (layers F.Cu)
(net 5 GND))
(pad 2 smd rect (at -1.9 6.475 270) (size 1 8.65) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at -0.25 -3.275 270) (size 4.3 2.25) (layers F.Cu)
(net 5 GND))
(pad 1 smd rect (at 3.045 -0.85 270) (size 3.79 1.2) (layers F.Cu)
(net 4 "Net-(AE2301-Pad1)"))
(pad 2 smd rect (at 0 2.725 270) (size 3.8 1.15) (layers F.Cu F.Paste F.Mask)
(net 5 GND))
(pad 2 smd rect (at 0 -2.725 270) (size 3.8 1.15) (layers F.Cu F.Paste F.Mask)
(net 5 GND))
(pad 1 smd rect (at 1.525 -0.925 270) (size 0.75 1.35) (layers F.Cu F.Paste F.Mask)
(net 4 "Net-(AE2301-Pad1)"))
)
(module dvk-mx8m-bsb:FR05-S1-NO-1-004 locked (layer F.Cu) (tedit 5BD9D8BA) (tstamp 5B7DD26A)
(at 148.5 82.4 270)
(path /5AF3486B/5B381782)
(solder_mask_margin 0.000001)
(attr smd)
(fp_text reference AE1802 (at -6.9 1) (layer F.SilkS)
(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value FR05-S1-NO-1-004 (at 0 -3.5 270) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(fp_circle (center -2.95 0) (end -2.875 0) (layer F.Fab) (width 0.15))
(fp_line (start 3.175 1.175) (end 3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 1.175) (end 3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 -1.175) (end -3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start 3.175 -1.175) (end -3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -6.3 4.5) (end 8 4.5) (layer Dwgs.User) (width 0.1))
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(fp_line (start 8 -1.5) (end -6.3 -1.5) (layer Dwgs.User) (width 0.1))
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)
(fp_line (start -8.7 -1.5) (end -9.6 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 -1.5) (end -9.6 7.7) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 7.7) (end -8.7 7.7) (layer Dwgs.User) (width 0.1))
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(fp_text user KEEPOUT (at -9.11 3.1) (layer Dwgs.User)
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(effects (font (size 1 1) (thickness 0.15)))
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(pad 1 smd rect (at -2.55 0 270) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask)
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(net 5 GND))
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(net 3 "Net-(AE1802-Pad1)"))
(pad 1 smd rect (at -4.6 3.101 270) (size 0.4 6.602) (layers F.Cu)
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(net 5 GND))
(pad 2 smd rect (at -0.35 7.3 270) (size 16.7 5.6) (layers B.Cu)
(net 5 GND))
)
(module dvk-mx8m-bsb:FR05-S1-NO-1-004 locked (layer F.Cu) (tedit 5BD9D8AC) (tstamp 5B7D9B32)
(at 136.3 60)
(path /5AF3486B/5B37EF16)
(solder_mask_margin 0.000001)
(attr smd)
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(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value FR05-S1-NO-1-004 (at 0 -3.5) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0) (layer F.Fab)
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)
(fp_circle (center -2.95 0) (end -2.875 0) (layer F.Fab) (width 0.15))
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(fp_line (start -3.175 -1.175) (end -3.175 1.175) (layer F.Fab) (width 0.1))
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(fp_line (start 8 -1.5) (end -6.3 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -6.3 -1.5) (end -6.3 4.5) (layer Dwgs.User) (width 0.1))
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)
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(fp_line (start -9.6 -1.5) (end -9.6 7.7) (layer Dwgs.User) (width 0.1))
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(fp_circle (center -5.1 0) (end -5.025 0) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.55 0) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask)
(net 2 "Net-(AE1801-Pad1)"))
(pad 3 smd rect (at 2.55 0) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -10.8 4.3) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 1 smd rect (at -3.35 0) (size 2.9 0.4) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 1 smd rect (at -4.6 3.101) (size 0.4 6.602) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 1 smd rect (at -4.6 5.451) (size 1.902 1.902) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 2 smd rect (at -9.15 8.9) (size 5.7 2.4) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -7.5 4.3) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -0.35 7.3) (size 16.7 5.6) (layers B.Cu)
(net 5 GND))
)
(module dvk-mx8m-bsb:MDT320E03001 locked (layer F.Cu) (tedit 5BD3276A) (tstamp 5BC869DE)
(at 127 113.315 180)
(descr MDT320E03001)
......@@ -1570,139 +1815,6 @@
)
)
(module dvk-mx8m-bsb:ACM4-5036-A1-CC-S locked (layer F.Cu) (tedit 5B904080) (tstamp 5B9649FE)
(at 118 60.9 270)
(tags "Chip Antenna")
(path /5B0D6F7B/5B123EED)
(solder_mask_margin 0.000001)
(attr smd)
(fp_text reference AE2301 (at 3.1 2.1) (layer F.SilkS)
(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value ACM4-5036-A1-CC-S (at 1.525 5.075 270) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.275 0.06) (end 2.275 3.575) (layer F.SilkS) (width 0.15))
(fp_line (start -1.1 3.3) (end -1.4 3.6) (layer Dwgs.User) (width 0.05))
(fp_line (start -0.3 3.3) (end -1.4 4.4) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.5 3.3) (end -1.4 5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.3 3.3) (end -1.4 6) (layer Dwgs.User) (width 0.05))
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(fp_line (start -1.35 1.15) (end -2.35 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.15 1.15) (end -2.4 1.4) (layer Dwgs.User) (width 0.05))
(fp_line (start -0.55 1.15) (end -1.55 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.25 1.15) (end -0.75 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 0.7) (end 1.9 2.7) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.05 -0.25) (end 1.65 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.25 -0.25) (end 0.85 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.65 -0.25) (end 0.3 1.1) (layer Dwgs.User) (width 0.05))
(fp_text user KEEPOUT (at 1.25 6.625 270) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_line (start 2.45 -0.25) (end 0.05 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.15 -0.55) (end 0.3 0.3) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.15 -1.35) (end 0.3 -0.5) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.05 -2.15) (end -2.4 -1.8) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.25 -2.15) (end -2.25 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start -0.45 -2.15) (end -1.45 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.35 -2.15) (end -0.65 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.15 -2.15) (end 0.15 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -2.5) (end 2.85 -1.45) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 -6.2) (end -2.4 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 1.15) (end -2.4 10.8) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 -2.15) (end 1.9 -2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 -2.15) (end 1.9 -4.4) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 -4.4) (end -1.4 -4.4) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 -4.4) (end -1.4 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 -5.2) (end 3.9 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -5.2) (end 3.9 -1.585) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -1.585) (end 4.9 -1.585) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.9 -1.45) (end 1.9 -1.45) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 -1.45) (end 1.9 -1.6) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 -1.6) (end 1.15 -1.6) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.15 -1.6) (end 1.15 -0.25) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.15 -0.25) (end 4.9 -0.25) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 -2.15) (end -2.4 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 -1.15) (end 0.3 -1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.3 -1.15) (end 0.3 1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.3 1.15) (end -2.4 1.15) (layer Dwgs.User) (width 0.05))
(fp_line (start -2.4 2.15) (end 1.9 2.15) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 2.15) (end 1.9 3.3) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.9 3.3) (end -1.4 3.3) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 3.3) (end -1.4 9.8) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 9.8) (end 3.9 9.8) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 9.8) (end 3.9 -0.115) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -0.115) (end 4.9 -0.115) (layer Dwgs.User) (width 0.05))
(fp_line (start -1.4 -4.4) (end -0.6 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start -0.6 -4.4) (end 0.2 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 0.2 -4.4) (end 1 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 1 -4.4) (end 1.8 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.8 -4.4) (end 2.6 -5.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.4 -5.2) (end 1.9 -3.7) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -4.9) (end 1.9 -2.9) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -4.1) (end 1.4 -1.6) (layer Dwgs.User) (width 0.05))
(fp_line (start 3.9 -3.3) (end 2.05 -1.45) (layer Dwgs.User) (width 0.05))
(fp_text user KEEPOUT (at 1.275 1.675 270) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_text user EDGE (at -1.125 -0.525 270) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_text user CUT (at -1.475 0.575 270) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_line (start -2.225 -1.15) (end -2.225 -3.675) (layer F.SilkS) (width 0.15))
(fp_line (start -2.225 -3.675) (end 2.275 -3.675) (layer F.SilkS) (width 0.15))
(fp_line (start 2.275 -3.675) (end 2.275 -1.76) (layer F.SilkS) (width 0.15))
(fp_line (start 2.275 3.575) (end -2.225 3.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.225 3.575) (end -2.225 1.15) (layer F.SilkS) (width 0.15))
(fp_circle (center 0 4.075) (end 0 4.15) (layer F.SilkS) (width 0.15))
(fp_line (start -2.4 10.8) (end 4.9 10.8) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.9 10.8) (end 4.9 -0.115) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.9 -1.585) (end 4.9 -6.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 4.9 -6.2) (end -2.4 -6.2) (layer Dwgs.User) (width 0.05))
(fp_line (start 1.875 -3.275) (end -1.875 -3.275) (layer F.Fab) (width 0.1))
(fp_line (start -1.875 -3.275) (end -1.875 3.275) (layer F.Fab) (width 0.1))
(fp_line (start -1.875 3.275) (end 1.875 3.275) (layer F.Fab) (width 0.1))
(fp_line (start 1.875 3.275) (end 1.875 -3.275) (layer F.Fab) (width 0.1))
(fp_circle (center 0 3.025) (end 0.075 3.025) (layer F.Fab) (width 0.15))
(fp_text user %R (at 0 0 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 2 smd rect (at 4.4 5.3425 270) (size 1 10.915) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 1.25 10.3 270) (size 7.3 1) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 4.4 -3.8925 270) (size 1 4.615) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at 1.25 -5.7 270) (size 7.3 1) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at -1.9 -4.175 270) (size 1 4.05) (layers F.Cu)
(net 5 GND))
(pad 2 smd rect (at -1.9 6.475 270) (size 1 8.65) (layers F.Cu)
(net 5 GND) (zone_connect 2))
(pad 2 smd rect (at -0.25 -3.275 270) (size 4.3 2.25) (layers F.Cu)
(net 5 GND))
(pad 1 smd rect (at 3.045 -0.85 270) (size 3.79 1.2) (layers F.Cu)
(net 4 "Net-(AE2301-Pad1)"))
(pad 2 smd rect (at 0 2.725 270) (size 3.8 1.15) (layers F.Cu F.Paste F.Mask)
(net 5 GND))
(pad 2 smd rect (at 0 -2.725 270) (size 3.8 1.15) (layers F.Cu F.Paste F.Mask)
(net 5 GND))
(pad 1 smd rect (at 1.525 -0.925 270) (size 0.75 1.35) (layers F.Cu F.Paste F.Mask)
(net 4 "Net-(AE2301-Pad1)"))
)
(module dvk-mx8m-bsb:PTN36043 locked (layer F.Cu) (tedit 5B7C0BA0) (tstamp 5B322B37)
(at 95.75 215.135)
(tags "USB Type-C SuperSpeed active switch")
......@@ -5644,118 +5756,6 @@
)
)
(module dvk-mx8m-bsb:FR05-S1-NO-1-004 locked (layer F.Cu) (tedit 5B7C0D05) (tstamp 5B7DD26A)
(at 148.5 82.4 270)
(path /5AF3486B/5B381782)
(solder_mask_margin 0.000001)
(attr smd)
(fp_text reference AE1802 (at -6.9 1) (layer F.SilkS)
(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value FR05-S1-NO-1-004 (at 0 -3.5 270) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(fp_circle (center -2.95 0) (end -2.875 0) (layer F.Fab) (width 0.15))
(fp_line (start 3.175 1.175) (end 3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 1.175) (end 3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 -1.175) (end -3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start 3.175 -1.175) (end -3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -6.3 4.5) (end 8 4.5) (layer Dwgs.User) (width 0.1))
(fp_line (start 8 4.5) (end 8 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start 8 -1.5) (end -6.3 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -6.3 -1.5) (end -6.3 4.5) (layer Dwgs.User) (width 0.1))
(fp_text user KEEPOUT (at 0 3.5 270) (layer Dwgs.User)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -8.7 -1.5) (end -9.6 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 -1.5) (end -9.6 7.7) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 7.7) (end -8.7 7.7) (layer Dwgs.User) (width 0.1))
(fp_line (start -8.7 7.7) (end -8.7 -1.5) (layer Dwgs.User) (width 0.1))
(fp_text user KEEPOUT (at -9.11 3.1) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_text user EDGECUT (at 0 -2.1 270) (layer Dwgs.User)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -5.1 0) (end -5.025 0) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.55 0 270) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask)
(net 3 "Net-(AE1802-Pad1)"))
(pad 3 smd rect (at 2.55 0 270) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -10.8 4.3 270) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 1 smd rect (at -3.35 0 270) (size 2.9 0.4) (layers F.Cu)
(net 3 "Net-(AE1802-Pad1)"))
(pad 1 smd rect (at -4.6 2.8358 270) (size 0.4 6.0716) (layers F.Cu)
(net 3 "Net-(AE1802-Pad1)"))
(pad 1 smd rect (at -4.6 5.1858 270) (size 1.3716 1.3716) (layers F.Cu)
(net 3 "Net-(AE1802-Pad1)"))
(pad 2 smd rect (at -9.15 8.9 270) (size 5.7 2.4) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -7.5 4.3 270) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -0.35 7.3 270) (size 16.7 5.6) (layers B.Cu)
(net 5 GND))
)
(module dvk-mx8m-bsb:FR05-S1-NO-1-004 locked (layer F.Cu) (tedit 5B7C0D11) (tstamp 5B7D9B32)
(at 136.3 60)
(path /5AF3486B/5B37EF16)
(solder_mask_margin 0.000001)
(attr smd)
(fp_text reference AE1801 (at 0 5.1) (layer F.SilkS)
(effects (font (size 0.77 0.77) (thickness 0.15)))
)
(fp_text value FR05-S1-NO-1-004 (at 0 -3.5) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(fp_circle (center -2.95 0) (end -2.875 0) (layer F.Fab) (width 0.15))
(fp_line (start 3.175 1.175) (end 3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 1.175) (end 3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start -3.175 -1.175) (end -3.175 1.175) (layer F.Fab) (width 0.1))
(fp_line (start 3.175 -1.175) (end -3.175 -1.175) (layer F.Fab) (width 0.1))
(fp_line (start -6.3 4.5) (end 8 4.5) (layer Dwgs.User) (width 0.1))
(fp_line (start 8 4.5) (end 8 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start 8 -1.5) (end -6.3 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -6.3 -1.5) (end -6.3 4.5) (layer Dwgs.User) (width 0.1))
(fp_text user KEEPOUT (at 0 3.5) (layer Dwgs.User)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -8.7 -1.5) (end -9.6 -1.5) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 -1.5) (end -9.6 7.7) (layer Dwgs.User) (width 0.1))
(fp_line (start -9.6 7.7) (end -8.7 7.7) (layer Dwgs.User) (width 0.1))
(fp_line (start -8.7 7.7) (end -8.7 -1.5) (layer Dwgs.User) (width 0.1))
(fp_text user KEEPOUT (at -9.11 3.1 90) (layer Dwgs.User)
(effects (font (size 0.75 0.75) (thickness 0.15)))
)
(fp_text user EDGECUT (at 0 -2.1) (layer Dwgs.User)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -5.1 0) (end -5.025 0) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.55 0) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask)
(net 2 "Net-(AE1801-Pad1)"))
(pad 3 smd rect (at 2.55 0) (size 1.3 2.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -10.8 4.3) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 1 smd rect (at -3.35 0) (size 2.9 0.4) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 1 smd rect (at -4.6 2.8358) (size 0.4 6.0716) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 1 smd rect (at -4.6 5.1858) (size 1.3716 1.3716) (layers F.Cu)
(net 2 "Net-(AE1801-Pad1)"))
(pad 2 smd rect (at -9.15 8.9) (size 5.7 2.4) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -7.5 4.3) (size 2.4 11.6) (layers B.Cu)
(net 5 GND))
(pad 2 smd rect (at -0.35 7.3) (size 16.7 5.6) (layers B.Cu)
(net 5 GND))
)
(module dvk-mx8m-bsb:mpcie-socket locked (layer F.Cu) (tedit 5B79B166) (tstamp 5B5A12D3)
(at 79.95 110.35)
(tags "mpci, pci, pci express")
......@@ -27451,7 +27451,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B7A) (tstamp 5B627B8E)
(at 132.5758 66.6 180)
(at 132.841 66.6 180)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5AF3486B/5B6D81D2)
......@@ -27485,7 +27485,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B43) (tstamp 5B627B9C)
(at 141.9 78.6758 90)
(at 141.9 78.941 90)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5AF3486B/5B8145DE)
......@@ -27553,7 +27553,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B91) (tstamp 5B627BB8)
(at 132.5758 69.6 180)
(at 132.841 69.6 180)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5AF3486B/5B74F73D)
......@@ -27586,8 +27586,8 @@
)
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B31) (tstamp 5B627BC6)
(at 138.9 78.6758 90)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5BD9DD67) (tstamp 5B627BC6)
(at 138.9 78.941 90)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5AF3486B/5B8145E5)
......@@ -28743,7 +28743,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B0A) (tstamp 5B627DA2)
(at 118.161 66.5 180)
(at 118.1365 66.5 180)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5B0D6F7B/5B208BC6)
......@@ -28777,7 +28777,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B25) (tstamp 5B627DB0)
(at 118.161 69.5 180)
(at 118.1365 69.5 180)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5B0D6F7B/5B208DA7)
......@@ -29331,7 +29331,7 @@
)
(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5B7B7B64) (tstamp 5B676562)
(at 68.65 83.502 90)
(at 68.65 83.5265 90)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags capacitor)
(path /5ACD5EDE/5BA66B56)
......@@ -29342,21 +29342,21 @@
(fp_text value NC (at 0 1.17 90) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1))
(fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1))
(fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1))
(fp_line (start 0.5 0.25) (end -0.5 0.25) (layer F.Fab) (width 0.1))
(fp_line (start -0.93 0.47) (end -0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.93 -0.47) (end 0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.93 -0.47) (end 0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.93 0.47) (end -0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.25 0.25) (thickness 0.04)))
)
(fp_line (start 0.93 0.47) (end -0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.93 -0.47) (end 0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.93 -0.47) (end 0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.93 0.47) (end -0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.25) (end -0.5 0.25) (layer F.Fab) (width 0.1))
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......@@ -29365,7 +29365,7 @@
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(module Capacitor_SMD:C_0402_1005Metric locked (layer F.Cu) (tedit 5BB921B5) (tstamp 5B676571)
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(at 71.57 83.5265 90)
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(path /5ACD5EDE/5BA66CB3)
......@@ -29376,21 +29376,21 @@
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......@@ -34466,7 +34466,7 @@
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(gr_text " 1. THIS BOARD SHALL CONFORM TO:\n IPC-6012, CURRENT REVISION, CLASS II\n IPC-A-600, CURRENT REVISION, CLASS II\n 2. OVERALL BOARD THICKNESS SHALL BE 0.89mm +/-0.1016mm (4.0mils), .\n 3. MATERIAL SHALL BE IT180A OR EQUIVALENT\n 4. SEE SUPPLEMENTARY PDF DOCUMENT FOR STACKUP COMPOSITION AND IMPEDANCE REQUIREMENTS.\n 5. USED SUPPLIED IPC-356 NETLIST TO PERFORM COMPARISON WITH GERBER DATA PRIOR TO MANUFACTURING.\n 6. APPLY SOLDERMASK OVER BARE COPPER, COLOR BLACK; MASK SHALL MEET IPC-SM-840.\n 7. SILKSCREEN SHALL BE WHITE NON-CONDUCTIVE INK, AND IS NOT PERMITTED ON ANY EXPOSED COPPER FEATURES.\n 8. SURFACE FINISH SHALL BE IMMERSION GOLD PER IPC 4552. COPPER FEATURES.\n 9. MINIMUM ANNULAR RING SHALL BE IN ACCORDANCE WITH IPC-6012 CLASS II.\n10. ALL HOLES SHALL BE LOCATED WITHIN +/- 75 UM (0.003 INCH) OF TRUE POSITION.\n11. ALL HOLES DIAMETERS INDICATED ARE FINISHED SIZE.\n12. LAYER TO LAYER REGISTRATION SHALL BE +/- 75 UM (0.003 INCH).\n13. COPPER FEATURES SHALL BE +/- 20% OF SUPPLIED DATA.\n14. COPPER PLATING THICKNESS SHALL BE IN ACCORDANCE WITH IPC-6012 CLASS II.\n15. WARP AND TWIST SHALL BE 0.75% IN ACCORDANCE WITH IPC-TM-650, #2.4.44\n16. REMOVE ALL SHARP EDGES AND BURRS: 75 UM (0.003 INCH) MAXIMUM.\n17. INSIDE RADIUS SHALL BE 0.06\" MAXIMUM.\n18. THERMAL VIAS SHALL BE NON-CONDUCTIVE EPOXY FILLED AND OVERPLATED.\n SURFACE MUST BE PLANAR WITH .002\" MAX. DIMPLE DEPTH ALLOWED.\n FILL REQUIREMENT AND COPPER THICKNESS PER IPC-6012 CLASS 2.\n19. PCBS SHALL BE PANELIZED. VENDOR TO PROVIDE PANEL DRAWING FOR APPROVAL\n PRIOR TO STARTING MANUFACTURING" (at 10.25 261) (layer Cmts.User) (tstamp 5B79DF35)
(gr_text " 1. THIS BOARD SHALL CONFORM TO:\n IPC-6012, CURRENT REVISION, CLASS II\n IPC-A-600, CURRENT REVISION, CLASS II\n 2. OVERALL BOARD THICKNESS SHALL BE 1.0mm +/-10%, .\n 3. MATERIAL SHALL BE IT180A OR EQUIVALENT\n 4. SEE SUPPLEMENTARY PDF DOCUMENT FOR STACKUP COMPOSITION AND IMPEDANCE REQUIREMENTS.\n 5. USED SUPPLIED IPC-356 NETLIST TO PERFORM COMPARISON WITH GERBER DATA PRIOR TO MANUFACTURING.\n 6. APPLY SOLDERMASK OVER BARE COPPER, COLOR BLACK; MASK SHALL MEET IPC-SM-840.\n 7. SILKSCREEN SHALL BE WHITE NON-CONDUCTIVE INK, AND IS NOT PERMITTED ON ANY EXPOSED COPPER FEATURES.\n 8. SURFACE FINISH SHALL BE IMMERSION GOLD PER IPC 4552. COPPER FEATURES.\n 9. MINIMUM ANNULAR RING SHALL BE IN ACCORDANCE WITH IPC-6012 CLASS II.\n10. ALL HOLES SHALL BE LOCATED WITHIN +/- 75 UM (0.003 INCH) OF TRUE POSITION.\n11. ALL HOLES DIAMETERS INDICATED ARE FINISHED SIZE.\n12. LAYER TO LAYER REGISTRATION SHALL BE +/- 75 UM (0.003 INCH).\n13. COPPER FEATURES SHALL BE +/- 20% OF SUPPLIED DATA.\n14. COPPER PLATING THICKNESS SHALL BE IN ACCORDANCE WITH IPC-6012 CLASS II.\n15. WARP AND TWIST SHALL BE 0.75% IN ACCORDANCE WITH IPC-TM-650, #2.4.44\n16. REMOVE ALL SHARP EDGES AND BURRS: 75 UM (0.003 INCH) MAXIMUM.\n17. INSIDE RADIUS SHALL BE 0.06\" MAXIMUM.\n18. THERMAL VIAS SHALL BE NON-CONDUCTIVE EPOXY FILLED AND OVERPLATED.\n SURFACE MUST BE PLANAR WITH .002\" MAX. DIMPLE DEPTH ALLOWED.\n FILL REQUIREMENT AND COPPER THICKNESS PER IPC-6012 CLASS 2.\n19. PCBS SHALL BE PANELIZED. VENDOR TO PROVIDE PANEL DRAWING FOR APPROVAL\n PRIOR TO STARTING MANUFACTURING" (at 10.25 261) (layer Cmts.User) (tstamp 5B79DF35)
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......@@ -35141,14 +35141,14 @@
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......@@ -61781,7 +61781,7 @@
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