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Librem 5 component list

This page provides additional information about the schematics and the list of components in the Librem 5.

Librem 5 releases

Abbreviations in schematics

The following abbreviations are used as the starting letter(s) to identify the components in the Librem 5 schematics:

  • ANT: antenna
  • C : capacitor
  • CON : connector
  • D : diode
  • F : fuse
  • J : wire link
  • JV : wire link with voltage
  • R : resistor
  • L : inductor
  • Q : transistor
  • SW : switch
  • TC : test control (or is it test connector?)
  • TP : test point
  • TS : test screw
  • TV : test voltage
  • TVS : transient voltage suppressor (type of diode)
  • U : integrated circuit
  • Y : crystal oscillator (used for clocks)
     

Components in main board

Evergreen, rev 1.0.2

Info about the main PCB:

  • 160 different parts
  • 1200 part placements on the PCB
  • PCB with 10 layers
    • Smallest parts 0201
    • Smallest ball pitch 0.4mm
    • Smallest diameter 0.254mm
  • All on the size of about two credit cards.
    Only a few contract manufacturers do this.

Librem 5 Dogwood's circuit boards with labeled components:
Librem_5_components_labeled

Note: Unfortunately, Purism hasn't released good quality photos of Dogwood or Evergreen, which flipped the i.MX 8M Quad processor on the other side, so it could dissipate heat through the back of the LCD and the phone's metal frame. The Microchip USB2642 USB 2.0 Hub & Flash media card controller should have a QFN package, but it appears to have a QFP package in the above photo. The Wolfson Media WM8962 audio DAC is probably the small chip to the right of the i.MX 8M Quad processor. The Texas Instruments BQ25895 I2C charge controller is probably underneath the metal shield near the 3-pin battery connector and the Winbond W25Q16JVUXIM TR SPI NOR Flash is probably located underneath the metal shield which is above the vibration motor.

Back side of the Librem 5 Evergreen's circuit boards with shields over the chips:
Evergreen_PCB

Front side of the Librem 5 Evergreen's main board with shields over the chips:
Front_side_Evergreen_main_PCB

Main PCB in Aspen: Back of Aspen's PCB

P.2 POWER TREE

All the chips in this page are detailed below, except this one:

  • TI LM3560 synchronous boost flash driver for camera
     

P.3 CPU POWER

  • U101:
    NXP i.MX 8M Quad (MIMX8MQ6DVAJZAB) 4x 1.5 GHz Cortex-A53, 64-bit, superscalar, 1MB L2 cache, 266 MHz Cortex-M4F, 256KB TCM cache, 800Mhz Vivante GC7000Lite GPU with 16 Vega shaders, Hantro G1/G2 video decoders (no hardware encode), Samsung 28nm, FBGA 621 balls, 0.65mm ball pitch, 17×17×2.03 mm
     

P.4 LPDDR4

  • U201:
    Micron MT53E768M32D4DT-053 WT:E mobile LPDDR4 SDRAM 3GB (32 x 768Mb) 2.133GHz, VFBGA-200, 10×14.5mm
    Note: This is Micron's automotive-series RAM. This RAM can support up to LPDDR4-4266, but the i.MX 8M Quad only supports up to LPDDR4-3200.
     

P.5 CPU IO

  • U3:
    Unidentified 12-pin chip which is labeled as "NC" (not connected) (pins: A1, A2, A3, A4, B1, B2, B3, B4, /0E & GND)
    Note: According to LuluColtrane: "The component is not placed. It was an optional voltage translator for the I2C bus. The voltage translation role is implemented by the two MOSFETs Q4 and Q5 instead."
  • Q4, Q5, Q8:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
  • D16, D20:
    ROHM RB751G-40 Schottky barrier diode 30V 30mA surface mount SOD-723 package
     

P.6 CPU MISC,RTC

  • D8, D22:
    ROHM RB751G-40 Schottky barrier diode 30V 30mA surface mount SOD-723 package
  • U39:
    Micro Crystal Switzerland RV-4162-C7 real time clock module with I2C bus
  • Y401:
    25MHz crystal oscillator
  • Y402:
    27MHz crystal oscillator
     

P.7 CPU PHY

  • Y501:
    Diodes Incorporated NX5427001Z 5032 crystal clock oscillator 27MHz ±25ppm 3.3V 6-Pin SMD T/R
     

P.8 EMMC

  • U601:
    Kioxia (formerly Toshiba) THGBMHG8C2LBAIR 32 GB NAND Flash, P-VFBGA-153, 11.5×13.0×1.0 mm, [datasheet for 64GB model]
    Note 1: Schematics say eMMC 5.0, but product description says MMC 5.1.
    Note 2: Probably TLC Flash, but there is no public info available on the type of Flash. Kioxia makes both FG NAND and BiCS NAND Flash memory.

Note: There is a floating comment with the following parts (which I assume Purism considered, but didn’t end up using):

P.9 PMIC

  • U1:
    ROHM BD71837MWV programmable power management integrated circuit (PMIC), 1.71-5.5 V input, max 4A output, 0.7 - 3.3 V output, UQFN-68 package, 8.0×8.0×1.0 mm
    Note: This is probably the BD71837MWV-E2, which is no longer in stock, so this part may change.
  • U704:
    Union Semiconductor UM805RE 4-Pin uP Voltage Monitors with Manual Reset Input
  • D3, D21:
    ROHM RB751G-40 Schottky barrier diode 30V 30mA surface mount SOD-723 package
    (for GPIO/WDOG PWR OFF->ON and Reset Button)
  • L702, L703, L704, L705, L707, L706, L710:
    Sunlord WPN252012ER47MT power inductor 470nH ±20% 4.1A 26mΩ SMD, 2.5×2.0×1.2 mm
    (for DRAM, VPU, GPU and VDD_1V8)
  • L32:
    Sunlord WPN252012H1R0MT wire wound power inductor 1uH ±20% SMD, 2.5×2.0×1.2 mm
  • Y1:
    Crystal oscillator 32.768 KHz 10pF ±20PPM (example)
     

P.10 BOOT CFG

  • Q7, Q10, Q11, Q14, Q18:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
    (for 3SW_KILL, BOOT_MODE0 and one for each color of RGB LED)
  • D27:
    OSRAM Opto Semiconductors LRTB R98G SMD three color LED
  • Q19:
    BCD Semiconductor AP2302 3A DDR-SDRAM termination regulator
  • U47:
    CQ3610BL-100 unidentified 3-pin component in PWM2
    Note: According to LuluColtrane: "Probably not an IC but a vibration motor."
  • D1, D4:
    Jiangsu Changjiang Electronics Technology B5817WS Schottky barrier diode, plastic-encapsulate SOD-323
  • SW3, SW5, SW7:
    Shenshen Elybest Electronics EL-MSK02 seven-legged toggle switches
  • TVS12, TVS13, TVS14, TVS15, TVS16:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode(one for each hardware kill switch, and Vol+ and Vol- buttons)
  • D9, D11, D13, D15, D18, D23, D24, D28, D29:
    ROHM RB751G-40 30V 30mA Schottky barrier diode, surface mount SOD-723 package
    (for audio, camera, Wi-Fi and 4G power switches, and PMIC_PWRON_KEY, ONOFF, PWR_KEY, and CHG_QON)
  • J1:
    OCN / Yaqi / Archie OK-501F006-13 6-pin connector to the Power and Volume buttons
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
  • TVS29:
    Nexperia PESD5V0S1BL low capacitance bidirectional ESD protection diodes, SOD882 package.
    (for power button)
     

P.11 USB TYPE C

  • U147:
    Winbond W25Q16JVUXIM TR SPI NOR Flash, 3V, 16M-bit, 4Kb Uniform Sector, DTR, SOIC-8, 150×150mil (3.8×3.8mm) or 200×200mil (5.1×5.1mm), [datasheet]
  • U6, U18:
    Nexperia PCMF1USB3S common-mode EMI filter for differential channels with integrated ESD protection, 1 channel [datasheet]
  • L24, L33, L38, L57, L82:
    Sunlord HPZ1005U121-1R1TF multi-layer chip ferrite bead, for high frequency noise suppression, 120Ω @ 100MHz, max 1.1A, 0402
    (for VDD_3V3 and 3 microphone lines)
  • U909:
    Texas Instruments TLV3201 single high speed (40 ns), low power (40 μA), push-pull output comparator [datasheet]
    (to power USB1 bus)
  • U10, U13:
    Nexperia PCMF2USB3S common-mode EMI filter for differential channels with integrated ESD protection, 2 channels, WLCSP-10_4-2-4, 1.57×1.17×0.57 mm, [data sheet]
  • U30:
    Texas Instruments HD3SS460 4x6-channel USB Type-C Alternate Mode mux/demux, WQFN-30, 2.5×4.5×0.5 mm, [datasheet]
  • L62, L63:
    Sunlord MZAH1005F352-R27TF multi-layer chip audio bead (for audio lines), max 1.00Ω 0.27A [datasheet]
    (for CC1 and CC2)
  • U27:
    Texas Instruments TPS65982 USB Type-C and USB PD controller, power switch, and high-speed multiplexer, BGA-96, 6×6 mm [datasheet]
  • Q1602:
    ON Semiconductor NTR2101PT1G MOSFET – single P-channel, small signal, SOT-23, -8.0V, -3.7A
  • D25:
    ON Semiconductor NSR20F30NXT5G 30V 2.0A Schottky Barrier Diode, 0603
     

P.12 CHARGE,BAT,LED

  • U15:
    Maxim Integrated MAX17055 7µA 1-cell fuel gauge with ModelGauge m5 EZ [datasheet]
  • L46:
    Mae Hong Son AMPI0618ED2R2MT SMD power wire-wound inductor / switching transformer / bead
  • U14:
    Texas Instruments BQ25895 I2C charge controller (supports up to 14V & 3.25A), WQFN-24, 4.0×4.0 mm
  • D5:
    Jiangsu Changjiang Electronics Technology B5817WS Schottky barrier diode, plastic-encapsulate SOD-323
  • L58, L59:
    Sunlord PZ3216D600-4R0TF multi-layer chip ferrite bead for noise suppression(for battery connector)
  • L60:
    Sunlord MZAH1005F352-R27TF multi-layer chip audio bead (for audio lines), max 1.00Ω 0.27A [datasheet]
    (for battery connector)
  • J20:
    BA32-111203-01 3-pin battery connector
     

P.13 SENSOR,SMART CARD

  • U300:
    Micropower AH3663 3-pin omnipolar Hall sensor
  • L22, L23, L56, L64, L72:
    Sunlord HPZ1005U121-1R1TF multi-layer chip ferrite bead
  • R105, R217:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
    (called “AP2281-3FMG” in schematic)
  • J9:
    SA0701127150-105 dual SIM and microSD tray
    Note: Comment 14 on P.1 says that J9 is a smart cart slot, but the schematics show it as a SIM + microSD tray.
  • (no designator):
    SA070112150-105 smart card slot
  • TVS8:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • U330:
    TI TXS4555 1.8V/3V SIM card power supply with level translator
  • U329:
    ST STM32L432KC ultra-low power Arm Cortex-M4 32-bit MCU+FPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, analog, audio, UFQFPN-32, 5.0×5.0×0.55 mm
  • Y2 (SMD_CRY32.768):
    Surface mount 32.768 KHz crystal oscillator (many possible suppliers)
  • U26:
    Vishay Semiconductor VCNL4040M3OE-H5 proximity and ambient light sensor with infrared emitter, I2C interface, and interrupt function, 4.0×2.0×1.1 mm
     

P.14 GNSS

  • CON1, CON2:
    AT10-110001-01 antenna for GNSS
  • L68:
    Sunlord SDCL0603Q5N6CT02 5.6 nH multi-layer chip ceramic inductor for RF circuits. [datasheet]
  • U20:
    Infineon BGA725L6 silicon germanium low noise amplifier for GNSS, TSLP-6-2 package, 0.7×1.1 mm, [datasheet]
  • Z1:
    RF360 Europe B39162B4327P810 signal conditioning 1582.4 MHz SAW RF filter for GNSS, 1.4×1.1×0.4 mm
    Note: RF360 Europe is a Qualcomm and TDK joint venture.
  • U32:
    STMicroelectronics Teseo-LIV3F GNSS (GPS/Galileo/GLONASS/BeiDou/QZSS, but no A-GPS), LCC-18 package, 9.7×10.1 mm, using UART2 bus
  • D19 (for VSYS_3V4_4V3):
    ROHM RB751G-40 30V 30mA Schottky barrier diode, surface mount SOD-723 package
  • L11 (for VSYS_3V4_4V3):
    Sunlord HPZ1005U121-1R1TF multilayer chip ferrite bead
  • U19:
    Texas Instruments TPS78001DRV 150mA low dropout regulator, ultra-low power (500nA) with pin-selectable, dual-level output voltage
  • U55:
    Texas Instruments SN74LVC1G125 single bus buffer gate with 3-state output
  • F5, F9:
    Nexperia IP4252CZ8-4-TTL Integrated 4-channel passive filter network with ESD protection [datasheet]
  • J10:
    OCN / Yaqi / Archie OK-06F024-04 24-pin connector
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
     

P.15 WIFI,BT

  • L10, L37 (for 3V3_WIFI):
    Sunlord HPZ1005U121-1R1TF multi-layer chip ferrite bead
  • J5:
    Shenzhen Chuangdian Electronic Technology APCI0136-P001A Key E M.2 67-pin connector, 1.8V
  • F5 (for SPI Flash), F6 (for UART4), F8 (for I2S SAI3), F9 (for I2C4 and UART1):
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • CON11, CON12:
    AT10-110001-01 WiFi antenna connectors
  • OCN / Yaqi / Archie OK-06F024-04 24-pin connector
    (front camera connector)
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
  • ANT2:
    ECT (Shenzhen Electric Connector Technology) ECT818000500 SMT-type micro coaxial RF connector
    (Pin 2 is not connected.)
  • R97:
    Diodes Incorporated AP2281-3FMG 2.2K single slew rate controlled load switch
  • U185:
    NXP NTB0104GU12 4-bit voltage level translator, bidirectional, 1-circuit 4-channel, 100Mbps, XQFN-12, 2.0×1.7×0.5 mm
  • Q6, Q9:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
  • F10, F11:
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • U25:
    Nexperia PCMF1USB3S common-mode EMI filter for differential channels with integrated ESD protection [datasheet]
  • U40:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
     

P.16 4G

  • ANT1:
    ECT (Shenzhen Electric Connector Technology) ECT818000500 SMT-type micro coaxial RF connector
  • CON7, CON8:
    AT10-110001-01 cellular antenna connectors
  • U12, U48:
    Diodes Incorporated AP2281-1FMG 6-pin single slew rate controlled load switch
  • U50, U51:
    Unidentified 6-pin chip which is labeled as “NC” (not connected) (pins: VOUT, GND, ON, VIN, GND, VIN)
    Note: According to LuluColtrane: "Components not placed. Most likely a placeholder for trying high-side MOSFET switches like the 2 AP2281 above if the AP2281 would have not been satisfying, for components with a different PCB footprint/pinout than the AP2281."
  • J3:
    APCI0103-P001A M.2 B-key H=4.8 NGFF socket
  • U9:
    Nexperia PCMF1USB3S common-mode EMI filter for differential channels with integrated ESD protection [datasheet]
  • TVS21:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • D6:
    ROHM RB751G-40 30V 30mA Schottky barrier diode, surface mount SOD-723 package
  • F14:
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • U5:
    NXP NTB0104GU12 4-bit voltage level translator, bidirectional, 1-circuit 4-channel, 100Mbps, XQFN-12, 2.0×1.7×0.5 mm
  • Q1:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
     

P.17 MIPI,DSI,CSI

  • U22:
    Texas Instruments SN74LVC1G125 single bus buffer gate with 3-state output
  • F7, F115:
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • U134, U117:
    Nexperia PCMF3USB3S common-mode EMI filter for differential channels with integrated ESD protection, 3 channels [datasheet]
  • U135, U136:
    Nexperia PCMF2USB3S common-mode EMI filter for differential channels with integrated ESD protection, 2 channels [datasheet]
  • TVS55:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • J22:
    OCN / Yaqi / Archie OK-06F034-04 34-pin 0.4mm pitch female inline connector
    (for rear camera connector)
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
  • U21, U37:
    Texas Instruments TLV75801PDBVR 500-mA, low-IQ, high-accuracy, adjustable ultra-low-dropout voltage regulator, SOT-23-5, 2.9×1.6 mm, [datasheet]
  • L18, L27, L45, L47, L48, L49, L54, L55, L65, L80:
    Sunlord HPZ1005U121-1R1TF multilayer chip ferrite bead
  • J4:
    OCN / Yaqi / Archie OK-06F024-04 24-pin connector
    (front camera connector)
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
  • U7:
    MicrOne ME6211C28M5G high speed LDO regulators, high PSRR, low noise
  • U33:
    STmicroelectronics LDCL015MR 150 mA capless ultra low drop linear regulator IC
  • U38:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
     

P.18 MICROSD,MOTO

  • U17:
    Texas Instruments TPS65132 single inductor - dual output power supply
  • L21:
    Sunlord WPN252012H3R3MT wire wound SMD power inductor [datasheet]
  • L52:
    Sunlord PZ0603D241-R35TF multi-layer chip ferrite bead
  • TVS23, TVS28:
    Nexperia PESD12VV1BL very low capacitance bidirectional ESD protection diode
  • TVS1, TVS2, TVS24, TVS25, TVS26:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • L8, L31, L40, L41, L42, L76, L77:
    Sunlord HPZ1005U121-1R1TF multilayer chip ferrite bead
  • L20:
    Nexperia PN252012H100MT 400 W Transient Voltage Suppressor [datasheet]
  • D2:
    Jiangsu Changjiang Electronics Technology B5817WS Schottky barrier diode, plastic-encapsulate SOD-323
  • U42:
    Texas Instruments LM36922 highly efficient dual-string white LED driver, DSBGA-12, 1.755×1.355 mm
  • J6:
    OCN / Yaqi / Archie OK-06F034-04 34-pin 0.4mm pitch female inline connector
    (for LCD connector)
    Note: Shenzhen Yaqi Technology Co. is part of OCN in Taiwan, and it produces the Archie brand.
  • F4:
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • U45:
    Nexperia PCMF2USB3S common-mode EMI filter for differential channels with integrated ESD protection, 2 channels [datasheet]
  • U29:
    Nexperia PCMF3USB3S common-mode EMI filter for differential channels with integrated ESD protection, 3 channels [datasheet]
  • U41:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
     

P.19 USB HUB

  • U2:
    Microchip USB2642 USB 2.0 Hub and Flash Media Card Controller, QFN-48, 7×7×0.9 mm
  • Y3:
    24 MHz crystal oscillator
  • U43, U44:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
  • J7:
    SA2101110135-01 dual SIM + microSD card tray
  • TVS4, TVS10:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • F1, F3, F13:
    Nexperia IP4252CZ8-4-TTL integrated 4-channel passive filter network with ESD protection [datasheet]
  • L79:
    Sunlord HPZ1005U121-1R1TF multilayer chip ferrite bead
  • Q3:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
     

P.20 AUDIO

  • L4, L5, L6, L53, L66, L67, L92:
    Sunlord MZAH1608G471-1R6TF multi-layer chip audio bead [datasheet]
  • U24:
    Wolfson Media WM8962 audio DAC, ultra-low power stereo CODEC with audio enhancement DSP, 1W stereo class D speaker drivers and ground referenced headphone drivers, W-CSP-49, 3.594×3.984×0.7 mm, data sheet
  • L50, L51, L61:
    Sunlord MZAH1005F352-R27TF multi-layer chip audio bead (for audio lines), max 1.00Ω 0.27A [datasheet]
  • L1, L7, L14, L16, L17:
    Sunlord HPZ1005U121-1R1TF multilayer chip ferrite bead
  • Q2:
    ROHM RYU002N05 0.9V Drive Nch MOSFET
  • Q12:
    Nexperia BSS138PW 60V, 320mA N-channel Trench MOSFET, SOT323 package
  • J2:
    JACK-JA-36A1-111 3.5mm audio jack
  • TVS5, TVS9, TVS17, TVS18:
    Nexperia PESD3V3S1UL unidirectional ESD protection diode
  • Y3:
    24MHz crystal oscillator
  • TVS3, TVS53, TVS58, TVS59:
    Nexperia PESD5V0S1BL low capacitance bidirectional ESD protection diodes, SOD882 package.
  • U46:
    Diodes Incorporated AP2281-3FMG-7 10K single slew rate controlled load switch
  • U78:
    STmicroelectronics LDCL015MR 150 mA capless ultra low drop linear regulator IC, SOT23-5
     

USB-C board components

(Evergreen, rev 1.0.2)

  • J10:
    US-3102-111 28-pin USB Type-C connector
  • U31:
    Solid State System 3SM222FMT1KA MEMS microphone IC with specialized pre-amplification & analog-to-digital converter ASIC to provide high SNR output from a capacitive audio sensor, LGA 8-pin
  • D15, D30:
    Everlight ELCH08-2025J3J6283910-N0 white LED light (gallium nitride), square lamp
  • J8:
    BTB6-1.27 6-pin board-to-board connector with 1.27mm pitch
  • D10:
    Nexperia PTVS16VS1UR 400 W Transient Voltage Suppressor [datasheet]
  • J11:
    Unidentified 46-pin connector
  • L68, L60, L70:
    Sunlord HPZ1005U121-1R1TF multi-layer chip ferrite bead
  • L2, L3:
    Sunlord MZAH1608G471-1R6TF multi-layer chip audio bead [datasheet]
  • ANT1:
    4-pin 4G antenna end, 1.5×0.6 mm
  • F1 (added in Evergreen):
    Littelfuse 400CC1206LR-C PPTC resettable fuse, datasheet

Components in the WiFi/Bluetooth M.2 board

Purism hasn't published the schematics for the M.2 2230 B-key card containing the Silicon Labs (formerly Redpine Signals) RS9116 WiFi/Bluetooth chip. This card is assembled by Silicon Labs in Hyderabad, India and contains the following ICs:

  • Silicon Labs RS9116N-DB00-CC0 dual band (2.4 & 5 GHz) WiFi 802.11 b/g/n, 802.11j, dual-mode Bluetooth 5, LGA-173, 9.1×9.8×1.6 mm, data sheet
    Note: The schematics (p.15) say "Bluetooth 4.1", but the RS9116 supports Bluetooth 5.0. However, only Bluetooth 4 [has been tested]

  • TI LSF0108 Eight channel auto-bidirectional multi-voltage level translator for open-drain and push-pull applications, VQFN-20, 4.50×2.50 mm

Front of the RS9116 WiFi/BT M.2 card (50 components):
Front of RS9116 WiFi M.2 card

Back of the RS9116 WiFi/BT M.2 card (37 components):
Back of RS9116 WiFi/BT M.2 card

Components in the cellular modem M.2 boards

Purism hasn't published the schematics for any of the M.2 3042 E-key cards (via USB 2.0 and I2S).

The M.2 cards containing the BroadMobi BM818-E1 / BM818-A1 / BM818-T1 are made by BroadMobi in China (spec sheet, FCC info). Purism is making in house the M.2 cards with the Thales Cinterion PLS8-E / PLS8-US modems.

Front of the BM818-E1 cellular modem (6 components):
Front of the BM818-E1 cellular modem

Front of the BM818-A1 cellular modem (6 components):
Front of the BM818-A1 cellular modem

Back of the BM818 cellular modem:
Back of the BM818 cellular modem

Other components in the Librem 5

The Librem 5 contains the following components, which aren't placed on one the four PCBs (main PCB, USB-C PCB, WiFi/BT M.2 card or cellular modem M.2 card):

  • Zhongshan Tianmo Battery Co. 1lCP10/55/47 3600mAh 3.8V 13.68Wh li-ion polymer battery, 62g (for Dogwood)

  • Zhongshan Tianmao Battery Co. 1ICP10/57/53 4500mAh 3.8V 17.1Wh li-ion polymer battery, 75g (for Evergreen)

  • Goodix GT5688 Touch IC

  • Mantix MLAF057WE51 X 5.7″ IPS a-Si LCD, 720×1440 pixels, 16.7M colors, 282 PPI, 1500:1 contrast ratio, 90% sRGB, MIPI DSI.
    Note: No mention of hardened glass, but the Librem 5 comes with a plastic screen protector.

  • Focaltech FT8006P LCD controller in the Mantix MLAF057WE51 X display

  • Samsung S5K3L6XX image sensor for back camera, 13.25 MP , CMOS, 1/3", 4224×3136 pixels, 4K@30fps, FHD@60fps, HD@120fps, f/1.9, 28mm, auto-focus: 10cm - ∞, 81.5° FOV, LED flash
    (not yet supported in kernel)

    Note: The Samsung S5K3L6XX is used in the Galaxy J4+, which takes decent photos according this review, but it has the Snapdragon 425 (4x 1.4GHz Cortex-A53, 28nm) which is comparable in CPU power to the i.MX 8M Quad and the J4+’s highest resolution video is 1080p at 30fps. The Samsung 13MP image sensor in the Librem 5 is capable of capturing 4K video at 30fps, but the i.MX 8M Quad has no hardware video encoder and its documentation indicates that it is only capable of encoding 1080p video at 30fps in software. There is currently no kernel support for the front and back cameras and there is only a mockup of a future camara app for the Librem 5.

  • SK hynix YACG4D0C9SHC image sensor for front camera, 8.0 MP, CMOS, 1/4", 3264×2448 pixels, QUXGA@30fps, FHD@60fps (crop), HD@90fps, focusing range: 28.9-65.0cm, 83.3° FOV
    (not yet supported in kernel)

Components whose manufacturer is unknown

In main board:

  • U47:
    CQ3610BL-100 3-pin component in PWM2
  • J20:
    BA32-111203-01 3-pin battery connector
  • CON1, CON2:
    AT10-110001-01 antenna for GNSS
  • J9:
    SA0701127150-105 SIM and microSD tray
  • (no designator):
    SA070112150-105 smart card slot
  • J3:
    APCI0103-P001A M.2 B-key H=4.8 NGFF socket
  • J2:
    JACK-JA-36A1-111 3.5mm audio jack
  • CON1, CON2:
    AT10-110001-01 antenna for GNSS
  • CON11, CON12:
    AT10-110001-01 WiFi antenna connectors

In USB-C board:

  • J10:
    US-3102-111 28-pin USB Type-C connector
  • J8:
    BTB6-1.27 6-pin board-to-board connector with 1.27mm pitch
  • J11:
    Unidentified 46-pin connector
  • ANT1:
    4-pin 4G antenna end, 1.5×0.6 mm

Component Count

Here is the component count in the Librem 5's two printed circuit boards:

Type of component Main PCB USB PCB
Antenna connectors (ANTxxx) 3 2
Capacitors (Cxxx) 521 11
Connectors (CONxxx) 6 8
Diodes (Dxxx) 26 1
Fuses (Fxxx) 15 1
Wire links (Jxxx) 18 2
Wire links with voltage (JVxxx) 2 0
Resistors (Rxxx) 333 7
Inductors (Lxxx) 79 7
Transistors (Qxxx) 17 0
Switches (SWxxx) 5 0
Test controls (TCxxx) 15 0
Test points (TPxxx) 60 0
Test screw (TSxxx) 12 4
Test voltage (TVxxx) 39 0
Transient voltage suppressors (TVSxxx) 33 0
Integrated circuits (Uxxxx) 65 2
Crystal oscillators (Yxxxx) 10 0
Total 1259 45

If the test elements aren't included (since they are printed in the board), then the two Librem 5 boards together have 1174 components. In addition, the RS9116 WiFi/Bluetooth M.2 card contains 87 components and the BM818 modem M.2 card contains 6 components, so the 4 boards in the Librem 5 contain a total of 1267 components.

In comparison, the typical smartphone has between 400 and 600 components, which shows how much easier it is to design a phone with an integrated mobile SoC. The Librem 5 has 2.5 times as many components as the typical smartphone, because it uses 6 separate chips (i.MX 8M Quad, RS9116, BM818/PLS8, Teseo-LIV3F, WM8962 and bq25895) in place of an integrated mobile SoC, plus it has extra circuitry for its hardware kill switches and the smartcard reader (which requires a separate ARM microcontroller).

It's interesting to compare the Librem 5 with the PinePhone, which has 4 chips in place of an integrated mobile SoC. The PinePhone contains 672 components in its two PCBs (not including the test elements).

Type of component Librem 5 main Librem 5 USB PinePhone main PinePhone USB
Antenna connectors (ANTxxx) 3 2 6 4
Capacitors (Cxxx) 521 11 296 16
Diodes (D/TVS/EDxxx) 59 1 22 0
Connectors (J/CONxxx) 26 10 14 4
Resistors (R/Fxxx) 348 8 222 0
Inductors (L/FBxxx) 79 7 21 0
Transistors (Qxxx) 17 0 16 19*
Switches (SWxxx) 5 0 1 0
Test points (T/TC/TP/TS/TVxxx) 126 4 27 3
Integrated circuits (U/DUxxx) 65 2 24† 2
Crystal oscillators (Y/Xxxx) 10 0 5 0
Total without test points 1133 41 627 45
Total with test points 1259 45 654 48

* 18 parts for the PinePhone USB-C port are labeled as Txxx in the schematic with the image of transistors, but it is possible that these are resistors and capacitors, just like in the Librem 5 schematic.

† There are 26 U/DUxxx listed in the PinePhone schematic, but the two extra are for an alternative magnetometer (U1200 / U1203) and an alternative gyroscope and accelerometer (U1202 / U1204) which are unpopulated.

Source: Amos Batto